Gen3 Systems has introduced the SPA 1000 solder paste analyser that targets OEMs wishing to ensure globally recognised, international soldering quality standards are maintained no matter where their products are manufactured.
The analyser is an integrated soldering instrument that performs all solder quality testing detailed by IEC and IPC international standards including: slump; solder ball; tack and wetting in accordance with IEC 61189-5 and IPC-TM-650; the IPC-TM-650 spread test; and Gen3’s own open time test to check the integrity of solder paste that has been sitting exposed (ie, ‘open’) to the atmosphere while ‘in-use’ on an assembly line.
Solder paste open time is a problem for assemblers because individual process conditions that can affect solder paste integrity will often vary from site to site and sometimes, from line to line.
Phone: 02 9695 1030
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