Taconic TSM-DS3 and RF-35TC thermal laminates

Taconic has introduced two laminates developed for high power applications where it is critical for the dielectric material to conduct heat away from other heat sources in the PWB design.

TSM-DS3 is the latest addition to the TSM-DS family of thermally stable, low loss cores. This ceramic-filled laminate with low (~5%) fibreglass content has a dissipation factor of 0.0011 at 10 GHz.

In addition to high power applications, the laminate was developed to have low coefficients of thermal expansion for demanding thermal cycling. The low x, y and z CTE values ensure that critical spacing between traces in filters and couplers have low movement with temperature.

RF-35TC is for high power applications where every 1/10th of a dB is critical and the PWB substrate must diffuse heat away from transmission lines and surface-mount components. This PTFE-based, ceramic-filled fibreglass material will not oxidise, yellow or show upward drift in dielectric constant and dissipation factor.

The low z axis coefficient of thermal expansion and temperature stable Dk make it suitable for narrowband and broadband overlay couplers. It has a dissipation factor of 0.0011 at 10 GHz.

With TSM-DS3 and RF-35TC, designers have the option of a 3.0 or 3.5 Dk laminate. Both materials are offered with low-profile copper, which yields lower insertion loss and good copper bond strength.