Würth Elektronik WE-TGF thermoconductive gap filler
With its WE-TGF thermal gap filler, Würth Elektronik offers a new solution for heat dissipation. The non-conductive barrier features a high dielectric strength and a high thermoconductivity index of 1 W/mK.
The self-adhesive gap-filler material easily adapts to the differing thicknesses of components on the PCB and fills the gaps between hot electronic components and metal casings or cooling components. It is made of silicone incorporating ceramic particles. For applications in which the PCB is screwed onto a metal plate, the material is also reinforced with a glass-fibre mesh.
The thermoconductive gap filler is suitable for use in power electronics, entertainment technology or networking devices. It is available in a variety of dimensions and in thicknesses ranging from 0.23 to 5 mm.
Phone: 03 8669 0610
Neousys POC-900 Series industrial computing platform
The Neousys POC-900 Series is suitable for smart factory, robotics and industrial inspection...
ASMPT SIPLACE V assembly platform
The SIPLACE V assembly platform is designed to handle large and heavy high-performance BGAs,...
Backplane IBASE AGS104L IoT gateway edge computing system
The IBASE AGS104L IoT gateway edge computing system provides a fanless computing platform for...
