Its a BLAST for 3G cellular networks
A new chip for mobile devices which was developed by Bell Labs team in Australia, implements multiple input/output wireless technology, called BLAST (Bell Labs Layered Space-Time). The technology is used in base station equipment and mobile devices, and is claimed to increase the capacity and coverage of wireless networks, and permit higher speed mobile data connections for notebook PCs and hand held devices.
The chips enable mobile devices to receive up to 19.2 megabits of data per second and are currently being incorporated into a BLAST demonstration system by Bell Labs in New Jersey.
Electronex 2026 to bring electronics innovation to Sydney
Electronex 2026 will return to Sydney's Rosehill Gardens in June, with over 100 electronics...
$6.9m funding to boost Aussie semiconductor packaging tech
The Australian Government has invested $6.9 million to accelerate semiconductor packaging and...
How power rivalry is reshaping semiconductor supply chains
Rising tensions between the US and China are changing how companies design global supply chains...

