Semiconductor joint research

IBM and Samsung say they will collaborate on basic research into new semiconductor materials, manufacturing processes and other technologies.

The agreement calls for the two companies to jointly develop new semiconductor process technology that can be used in a broad range of applications - from smartphone handsets to communications infrastructure.

For the first time, Samsung researchers will join IBM scientists in the Semiconductor Research Alliance at the Albany Nanotech Complex, Albany, US, where researchers will investigate new materials and transistor structures, as well as interconnect and packaging solutions for next-generation technology nodes.

The research developments from this joint activity are planned to enable the delivery of silicon solutions that are optimised for performance, power consumption and size.

New process technology developed by the companies is planned to extend leadership in mobile computing as well as other high-performance applications. For consumers, a new generation of devices - smarter, connected and more mobile - will require essential semiconductor breakthroughs to keep pace with technology trends (ie the mobile web, cloud computing,) and users' loftier expectations around performance and reliability.

The agreement also renews IBM and Samsung's joint process development agreement to multiple nodes starting at 20 nm. IBM and Samsung plan to develop technologies for foundry customers, enabling high-performance, energy-efficient chips at 20 nm and beyond. To further enhance the JDA, Samsung’s Semiconductor R&D centre will also participate in development contribution.