Chip made on 90 nm process

Texas Instruments' fully functional wireless digital base band on 90 nm process offers many benefits. By shrinking the dimension of the transistors power consumption, size and manufacturing costs are reduced relative to the previous manufacturing process. Distances between transistors are also reduced, increasing overall processor performance and allowing integration of many more features on an equivalent size chip.

The 90 nm process features transistors 37 nm, a width 2000 times smaller than the thickness of newsprint, with the ability to pack over 400 million transistors on a single chip.

With up to nine layers of copper metal, the 90 nm process also supports integration of a wide array of analog and radio frequency (RF) components for SoC development. Integration of analog and RF components for communication transmit and receive functions, and for analog-to-digital and digital-to-analog conversion circuits, is critical to a wide range of signal processing applications.