ADLINK Technology has launched the LEC-IMX8MP SMARC module, a SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP’s next-generation i.MX 8M Plus SoC for edge AI applications. The product integrates NXP NPU, VPU, ISP and GPU computing in a compact size for futureproof AI-based applications across Industrial AIoT/ IoT, smart homes, smart cities and beyond.
The powerful quad-core Arm Cortex-A53 processor runs up to 1.8 GHz with an integrated neural processing unit (NPU), delivering up to 2.3 TOPS for machine learning inference at the edge. It is suitable for applications that require machine learning and vision systems paired with smart sensors to enable industrial decision-making.
The module features LVDS/DSI/HDMI graphic output, dual CAN bus/USB 2.0/USB 3.0, dual GbE ports (one with TSN) and I²S audio interface in a low-power envelope that is typically below 6 W. Its rugged design can sustain operating temperatures of -40 to +85°C, and high shock and vibration environments for use in harsh industrial applications.
BSP support for Debian, Yocto and Android, including MRAA hardware abstraction layer (HAL), allows engineers to substitute modules, sensor HATs and port code written in Raspberry Pi or Arduino environments to the i-PI. Delivering edge intelligence, machine learning and vision for a smart world, the platform can be used for AI-based applications, removing cloud dependency and preserving individual privacy.
Phone: 0011 886 2 8226 5877
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