congatec conga-TC170 COM Express compact modules

The conga-TC170 COM Express compact modules, from congatec, are said to offer users improvements in graphics and processing performance, enhanced energy efficiency and high-speed I/Os.

Users will benefit from the high level of standardisation and scalability of the COM Express modules — combined with congatec’s documentation, industry-grade driver implementations and customer support — which enable OEMs to integrate the latest processor technology quickly and efficiently into their individual applications. All modules are offered with long-term availability and software support of at least seven years.

The modules, with COM Express Type 6 pinout, are equipped with the ULV-SoC editions of the sixth-generation Intel Core i3/i5/i7 processors. They offer a configurable TDP (thermal design power) of 8.5 to 15 W, which simplifies matching the application to the system’s thermal design. The optimised power supply, in addition to the microarchitecture, contributes to the energy efficiency and enables a longer turbo-boost.

The modules are designed for challenging applications that demand high performance in sealed, fanless system designs, such as in medical and industrial imaging, central control room technology, shop floor terminals, HMIs, robotics, professional gaming, infotainment, professional AV, smart video surveillance, autonomous vehicle control, computer-aided situational awareness and high-end digital signage applications.