SKiiP4, the latest generation of intelligent IGBT power modules, has a longer service life than non-sintered modules and can be used in higher temperatures.
The power pack is claimed to be the most powerful intelligent power module on the market and is 33% more powerful than its predecessor SKiiP 3.
The IPM is used predominantly in wind and solar power applications, traction applications, lift systems and industrial drives with high outputs of between 400 kW and 1.8 MW.
The increased power is through the use of a pressure contact system, an improved heat sink and IGBT4, CAL4 chip technology.
In addition, six parallel half bridges have been used for the first time at the upper power end instead of four.
The semiconductor chips are not soldered to the ceramic substrate but are sinter-joined, meaning that higher operating temperatures are possible with no compromise on reliability.
The sinter bond is a thin silver layer which has a lower thermal resistance than a bond with solders. The high melting point of silver prevents premature material fatigue.
The solder-free pressure contact system and the integrated laminated power rails ensure homogenous current distribution. Every IGBT and diode chip is connected to the main terminal separately, keeping the module resistance low.
As these modules have no base plate, the solder-free connection between DCB and heat sink is quasi-flexible, which is why the thermal cycling capability has no upper limits.
The device is available with blocking voltages of 1200 and 1700 in dual-pack topologies with three, four or six parallel half bridges per IPM.
Phone: 03 8561 5635
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