STMicroelectronics X-CUBE-ISPU toolchain and software
STMicroelectronics has released a toolchain and accompanying software package for programming the intelligent sensor processing unit (ISPU) embedded in the latest-generation intelligent MEMS IMUs, ISM330IS and LSM6DSO16IS. The toolchain and software help employ the ISPU to handle motion-related workloads such as activity recognition and anomaly detection directly in the sensor. This permits reducing system power and latency, offloading the local microcontroller and specialising the behaviour of the sensor to the application.
Using the ISPU toolchain, developers can program the sensor’s intelligent processing unit using C programming. Users can choose to work from a command line interface (CLI) or an Eclipse-based environment like STM32CubeIDE, and to use a graphical user interface (GUI) such as AlgoBuilder and Unicleo.
The X-CUBE-ISPU software package contains templates and example projects as well as ready-to-use libraries that help developers understand how to use and program the sensors’ ISPU and can be used as a starting point to implement custom algorithms. Pre-built files are also available, which lets users load the X-CUBE-ISPU examples directly into the sensor using one of the GUIs, with no coding required. In addition, a GitHub repository is available providing more examples, tutorials, and other development resources.
Using these resources helps make short work of developing applications such as personal electronics, including wearable devices for activity recognition and health monitoring, as well as industrial devices such as asset trackers, equipment-condition monitors, robots and machine controllers.
ST’s ISM330IS and LSM6DSO16IS inertial modules contain an always-on 3D accelerometer and 3D gyroscope with the embedded ISPU. They feature low power consumption, drawing 0.46 mA in low-power mode, and low noise at 70 μg/√Hz in high-performance mode. Sensor hub functionality allows them to collect data from up to four additional external sensors. An embedded temperature sensor is also included, and each device is housed in a 2.5 x 3 x 0.83 mm plastic land grid array (LGA) package.
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