TDK IC embedded power management module for smartphones and tablets

TDK Corporation has released a series of highly integrated, multichannel power management modules for smartphones and tablets. Based on TDK’s SESUB technology (semiconductor embedded in substrate), the IC embedded power management module features high efficiency and a 5-channels step-down converter power supply with an output of up to 2.6 A.

Aimed at reducing lead times and development costs for manufacturers of smartphones and tablets, the product features a power supply management IC chip that is embedded directly into the substrate. In combination with newly developed surface-mounted capacitors and power inductors, this results in a space-saving footprint that is up to 60% smaller than discrete solutions. The highly integrated module offers advanced multichannel power management capabilities in a single miniature package with dimensions of 11.0 x 11.0  x 1.6 mm.

The major features of the power management module are its high-efficiency step-down converter power supply in a 5-channel configuration with a maximum output of 2.6 A, and its low-noise, low-loss voltage regulator power supply for up to 23 channels. A highly efficient lithium-ion secondary battery charging circuit is also included. Due to the fact that the IC is completely embedded in the miniature three-dimensional SESUB structure, the module features good thermal attributes compared with solutions with discrete packaged ICs. The module also offers improved EMC performance due to the self-shielding effect of its design.

The series is designed to meet the emerging needs for miniaturised multifunctional power management modules able to provide all of the functions in a smartphone with the right amount of power, thus contributing to longer battery life.