Siemens launches AI agent to automate PCD design workflows

Siemens has introduced the Fuse EDA AI Agent system, a new artificial intelligence system that is designed to plan and orchestrate complex semiconductor, 3D IC and printed circuit board (PCB) system workflows, including verification and manufacturing. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the AI system manages workflows across Siemens’ EDA portfolio, delivering automation that accelerates engineering productivity and achieves higher-quality designs.

Amit Gupta, Chief AI Strategy Officer at Siemens EDA, said the AI system moves from in-tool AI capabilities to autonomous, end-to-end workflow orchestration.

“We are delivering intelligent automation across the complete EDA lifecycle, enabling our customers to reduce design cycles while maintaining high-quality standards. Our open architecture allows customers to integrate their own workflows and models, providing the flexibility required for enterprise-scale AI deployment. This positions the industry to maintain a competitive advantage in an increasingly complex semiconductor and PCB system landscape,” Gupta said.

The Fuse EDA AI Agent features a sophisticated RAG pipeline, a multimodal EDA-specific data lake, specialised parsers for EDA file formats, customisable access controls, support for multiple AI models and an open approach for third-party integrations.

According to Siemens, the AI agent provides automated planning and execution across each stage of chip and PCB development. In the front-end design and verification states, the Fuse Agent supports the automation of architectural exploration, design-planning and register-transfer level (RTL) coding with Siemens’ Catapult software. For digital verification, the Fuse Agent also assists with testbench generation, debugging and more through integration with the Questa One Agentic toolkit.

As designs move to physical implementation, the Fuse Agent assists with place-and-time, timing closure and power optimisation through direct integration with Siemens’ Aprisa software. The AI Agent also accelerates custom design and verification with Siemens’ Solido software.

In 3D IC design, the AI Agent manages power/ground load optimisation and automates the creation of signal path plan clustering in Innovator3D IC software. For PCB development, it aids layout, signal integrity and other analyses in Xpedition and Hyperlynx software. It also supports manufacturing readiness through Tessent for design-for-test processes and integrates with Calibre for optical proximity correction (OPC).

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