Harwin S0911-46R and S0921-46R EMI/RFI shield clips
Covering a surface area of 2.3 x 1.2 mm with 2 mm height, Harwin’s S0911-46R shield can clip is designed to address the demands being set by the latest generation of high-density electronic systems.
The surface mount EMI/RFI shield clip, which has a beryllium copper construction with tin over nickel plating, enables shielding cans with sides of 1 mm in length to be fitted, so that minimal board real estate is taken up. Designed for 0.2 mm can thicknesses, it is suitable for cans that have complex shapes.
The device is accompanied by the S0921-46R corner shield can clip, which provides additional shielding at the corner gaps of cans. This clip component is able to accommodate Harwin’s larger thickness shield cans (0.3 mm thick), with each corner clip only taking up 6 mm2 of PCB surface area.
By using the clip-based approach propounded by these products, engineers are able to avoid needing to solder the required shield can to the PCB. This not only simplifies the production process, but offers flexibility too. Attaching the shield can to the board is a straightforward procedure that may be carried out rapidly. Since solder is no longer needed, environmental impact is much less of a concern. It also eliminates the heat sink effect that is associated with direct soldering of the can to the PCB. Furthermore, the shield can be easily removed after deployment for inspection or maintenance purposes.
The shield clips are targeted for use in electronics designs where space is seriously restricted, such as wearable devices (smart watches, fitness trackers), IoT equipment (sensor nodes, data acquisition modules) and portable consumer products (smartphones, MP3 players, action cameras). Their compact design means that they are suitable for a broad array of different applications and an operational temperature range covering -55 to +105°C is supported. Shipped in a tape-and-reel format, they are optimised for automated production lines.
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