Assembly > Research

Radiation-proof chips built for Large Hadron Collider

15 August, 2025 by Grant Currin, Columbia University School of Engineering and Applied Science

Columbia engineers and physicists partnered with CERN to develop chips that can withstand radiation deep inside the world's largest particle accelerator.


Hybrid photonic-terahertz chip enhances communications

14 August, 2025 by Celia Luterbacher, EPFL

Researchers at EPFL have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.


Invisible material could enhance smart tech

07 August, 2025

Scientists have developed a transparent, metal-like polymer using hyaluronic acid that could revolutionise wearables, touchscreens and biosensors.


Novel method gives semiconductors a magnetic boost

31 July, 2025 by Wayne Lewis, California NanoSystems Institute at UCLA

Researchers have unveiled a new method for combining magnetic elements with semiconductors; this could pave the way for the next generation of faster and more energy-efficient technologies.


Electronic–photonic quantum chip created in foundry

17 July, 2025

A team of scientists have fabricated a silicon chip, combining quantum light with electronic circuits.


Embedding invisible digital information in printed documents

09 July, 2025

Researchers have developed a system for embedding invisible digital information in printed documents using infrared ink and a special camera.


Researchers crack scalable CMOS quantum computing

26 June, 2025

Researchers from the University of Sydney have developed a cryogenic CMOS chip capable of controlling spin qubits at temperatures close to absolute zero.


Semiconductor advance paves the way for faster electronics

17 June, 2025

Researchers have developed a streamlined method for growing tin sulfide (SnS), a semiconductor material with potential applications in next-gen electronics.


Novel decentralised AI chip works without the cloud

28 May, 2025

Researchers have developed a new AI chip that works without the cloud server or internet connections needed by existing chips.


3D printing tech improves durability of 'smart wearables'

22 May, 2025 by Shawn Vestal, Washington State University

Researchers have developed a 3D printing method for smart fabrics that maintains performance after repeated washing and wear.


Sound waves enhance nonlinearity in photonic computing

30 April, 2025 by Max Planck Institute for the Science of Light

Scientists have demonstrated that sound waves can serve as mediators for effective photonic activation functions.


New method to stop electronics from overheating

23 April, 2025 by University of Virginia School of Engineering and Applied Science

Researchers have discovered an innovative method to keep electronic devices cooler for longer.


Novel, non-toxic synthesis method for MXene

23 April, 2025 by Pierluigi Bilotto, TU Wien

MXene, a nanomaterial used in battery technology, can be difficult and hazardous to produce. Now, researchers have developed safer methods for its production.


A surprise contender for cooling computers: lasers

16 April, 2025 by Troy Rummler, Sandia National Laboratories

Laser cooling company Maxwell Labs has partnered with Sandia National Laboratories to develop laser-based photonic cooling for high-density data centre processors.


Terahertz wave control for enhanced wireless technology

27 March, 2025

Researchers have developed a new patterned spintronic emitter that enables room-temperature control of terahertz wave polarisation.


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