Business > Market analysis

Demand for displays still climbing

11 September, 2010

Shipments of small and medium displays continued to climb in Q2 10, with US$5.4 billion in revenue, up 31% Y/Y. According to the latest Quarterly Small/Medium Shipment and Forecast Report, this segment is forecast to experience continued growth, reaching US$6.7 billion in Q3 10.


Taiwan's electronics industry continues buoyant growth

20 August, 2010 by Elizabeth Latham

At the invitation of the Taiwanese government, the assistant editor of What's New in Electronics, Elizabeth Latham, joined a party of international journalists to visit factories where some of the latest technical advances were being made by some of the companies in this highly developed industry. Here is what she found:


European photovoltaic market unstable

20 August, 2010

The pace of the European solar photovoltaic market in the first half of 2010 was dominated by the impending mid-year incentive tariff reductions in Germany and conditioned by the lower module pricing that emerged through 2009, according to the latest from Solarbuzz in Europe PV Markets 2010.


PC shipments set to grow 20%

20 August, 2010

The Asia Pacific personal computer market is forecast to grow 20.3% in 2010, reaching 114.6 million unit shipments, according to Gartner’s latest forecast.


TFT LCD shipments reach records

12 August, 2010

May 2010 shipments of large-area TFT LCD panels were 58.8 million units, up 9% from April, and revenues were 7.5 billion, up 7% M/M, according to the DisplaySearch Monthly TFT LCD Shipment Database.


Mobile PC shipments grow by 43%

05 July, 2010

Worldwide mobile PC shipments totalled 49.4 million units in the first quarter of 2010, a 43.4% increase from the first quarter of 2009, according to final results by Gartner.


Viewing angle technologies and LED backlit notebooks

01 July, 2010

According to the latest DisplaySearch Quarterly Wide Viewing Angle Technology Report, vertical alignment viewing angle technology continues to lead in wide viewing angle technologies.


All-in-one PCs show strong growth

15 June, 2010

All-in-one PCs enjoyed a 57% growth in sales from 2008 to 2009, led by Apple and its continued strong iMac sales. HP, Dell, Lenovo, Acer (including its Gateway and Packard Bell brands) contributed to this growth, as well as second-tier brands such as MSI.


IT spending set to grow by 5.3%

07 June, 2010

Worldwide IT spending is forecast to reach $3.4 trillion in 2010, a 5.3% increase from IT spending of $3.2 trillion in 2009, according to Gartner.


Chinese IT spending will reach $259 billion

07 June, 2010

Spending on information technology by consumers and enterprises in China is expected to reach $259 billion this year, offering substantial opportunities for technology and service providers, according to Gartner.


Slow but steady demand for personnel

31 May, 2010

There is a slow but steady, with many bumps along the way, upturn in demand for people in the electronic industry, says Roy Dickson, senior consultant, Technology Australia Wide Personnel Engineering, Manufacturing and Technical Recruiters.


Fluke TiR32 thermal image camera

19 May, 2010 by

The Fluke TiR32 can scan large areas quickly to detect problems or the extent of any damage. The handheld instrument delivers clear, crisp images needed to find problems fast with its 320 x 240 sensor.


RAST - the old/new appliance standard

20 April, 2010 by Lynda Nolen, Bishop & Associates

The global market for connectors used in consumer applications is expected to top $2.8 billion by 2013. A key segment of the consumer market is the household appliance, or whitegoods, industry.


GigE transceivers set to grow

18 February, 2010

According to a report from CIR, US market analysts, the market for 40/100 GigE transceivers will reach $640 million in revenue by 2014, with about two-thirds coming from 40 GigE products.


Packaging and 3D come under scrutiny

03 December, 2009

The continuation of Moore’s law by conventional CMOS scaling is becoming more and more challenging, requiring huge capital investments. 3D packaging with 3D TSV interconnects provides another path towards the 'More than Moore', with relatively smaller capital investments.


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