MACOM MASW-011060 SP2T reflective switch
03 February, 2016 | Supplied by: Wireless ComponentsThe MASW-011060 is a high-power PIN diode SP2T switch in a common anode configuration, operating from 0.5 to 6 GHz.
Electrons, liquid helium and zero-resistance phenomenon
02 February, 2016 by Olga GarnovaThe end of Moore’s Law — the prediction that transistor density would double every two years — was one of the hottest topics in electronics-related discussions in 2015.
Multipurpose programmable optical chips
01 February, 2016Researchers have designed multipurpose programmable optical chips that could revolutionise the microwave photonics industry.
Toshiba TKR74F04PB power MOSFET
01 February, 2016 | Supplied by: Toshiba (Australia) Pty LtdToshiba has launched a 40 V N-ch power MOSFET for automobile applications, including DC-DC converters, high-capacity motor drivers for electric power steering (EPS) and semiconductor relays.
Skyworks SKYA21001 SPDT switch
30 January, 2016 | Supplied by: Wireless ComponentsSkyworks Solutions has released the SKYA21001 single-pole, double-throw switch. The switch features low insertion loss (0.4 dB at 2.4 GHz) and positive voltage operation with low DC power consumption (10 μA).
Vicor Corporation PFM AC-DC front-end modules
30 January, 2016 | Supplied by: Vicor CorporationVicor Corporation has announced an addition to its family of high-density PFM AC-DC front-end modules in a rugged VIA package that offers good cooling performance and versatility in converter mounting.
Advantech MIO-3260 2.5″ Pico-ITX SBC
29 January, 2016 | Supplied by: Advantech Australia Pty LtdAdvantech has launched the MIO-3260 — a 2.5″ MI/O-ultra form factor (Pico-ITX) SBC with Intel Celeron Quad Core N2930/Atom Dual Core E3825 processor. The unit supports DDR3L memory, up to 8 GB, and its fanless design and low power consumption (4.47 to 9.73 W) offer good power savings. All I/O functions come from internal connectors.
Nanoelectronics temperature breakthrough
28 January, 2016Researchers have managed to make electrons in a circuit on a silicon chip colder than had previously been achieved.
The internet of the future?
27 January, 2016A new scientific solution that enables future internet infrastructure to become completely open and programmable while carrying internet traffic at the speed of light has been developed.
Vishay Intertechnology IGBT power modules for TIG welding machines
26 January, 2016 | Supplied by: Digi-Key ElectronicsVishay Intertechnology has introduced four half-bridge and single-switch IGBT power modules designed specifically for TIG welding machines.
Avalue ECM-SKLH, EBM-SKLU and ESM-SKLH embedded computing boards
26 January, 2016 | Supplied by: Braetec Pty LtdAvalue has unveiled three embedded computing boards based on the sixth-generation Intel Core i7/i5/i3 processors and latest Xeon processors. The range comprises the 3.5″ micro module ECM-SKLH, the 5.25″ mini module EBM-SKLU and the computer-on-modules ESM-SKLH.
STMicroelectronics powers 100 million Indian set-top boxes
22 January, 2016 | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics has shipped its 100 millionth chipset for digital cable and satellite set-top boxes (STBs) in India.
ANADIGICS AWL5911 power amplifier
22 January, 2016 | Supplied by: Wireless ComponentsANADIGICS has released the AWL5911 power amplifier, an easy-to-use module that delivers high levels of linearity and efficiency for high data rate applications. Designed for the 5 GHz WLAN standards, it supports IEEE 802.11a/n/ac applications.
Developing power systems for lighting applications
22 January, 2016 | Supplied by: Vicor CorporationLight emitting diodes (LEDs) allow large structures to be illuminated using minimal energy. These LED lights require power chains that convert an AC utility supply to a constant current DC supply.
Cooling system for processors of the future
21 January, 2016 by Moscow Institute of Physics and TechnologyResearchers from MIPT have demonstrated how to efficiently cool optoelectronic chips using industry-standard heatsinks in spite of high heat generation in active plasmonic components. These components will be essential for high-speed data transfer within the optoelectronic microprocessors of the future.
