Components

Organic semiconductors get weird at the edges

07 October, 2015

A new finding could lead to the next generation of cheaper, more efficient electronic devices.


Australian researchers overcome crucial quantum computing hurdle

07 October, 2015 by Wilson Da Silva

Australian engineers have built a quantum logic gate in silicon for the first time, making calculations between two qubits of information possible — and thereby clearing the final hurdle to making silicon quantum computers a reality.


Vicor Corporation Picor PI354x Cool-Power ZVS buck regulators

02 October, 2015 | Supplied by: Vicor Corporation

PI354x Cool-Power ZVS buck regulators utilise the integration of high-performance zero-voltage switching (ZVS) topology that enables 48 V direct to PoL without sacrificing performance, providing efficiency over 96%. With step-down regulation from a higher voltage source, engineers can deploy efficient power distribution architectures, reduce I2R losses and eliminate intermediate conversion stages.


New method could lead to cheaper electronic tattoos

30 September, 2015

Researchers have developed a faster and inexpensive method to produce disposable tattoo-like health monitoring patches.


Vicor Corporation VIA BCM DC-DC front-end module

30 September, 2015 | Supplied by: Vicor Corporation

Vicor Corporation has introduced its VIA BCM K=1/8 DC-DC bus converter module. Operating from a 380 VDC nominal input and delivering an isolated SELV 48 V output, the product provides functional integration in a 9 mm-thin, thermally adept module incorporating EMI filtering, transient protection and inrush current limiting.


Self-assembling microflowers open new electronic frontiers

30 September, 2015

RMIT University researchers have developed artificial microflowers that self-assemble in water and mimic the natural blooming process, an important step for advances in frontier-edge electronics.


Vishay Dale IHLD-3232HB-5A dual inductor

30 September, 2015 | Supplied by: Future Electronics

Vishay Intertechnology has expanded its IHLD series of low-profile, high-current dual inductors with a device in the 3232 case size. Offering a high operating temperature range to 155°C, the automotive-grade IHLD-3232HB-5A saves board space by combining two inductors in one 9.75 x 9.14 mm package.


Big investments boost flexible sensors market

29 September, 2015 by Guillaume Chansin, Senior Technology Analyst, IDTechEx Research

The US Department of Defense recently awarded $75 million to establish a new Manufacturing Innovation Institute (Mii) for flexible hybrid electronics in San Jose, California.


First optical rectenna converts light to direct current

29 September, 2015

The first optical rectenna, a device that combines the functions of an antenna and a rectifier diode, can convert light directly into direct current.


MACOM MAAP-011140-DIE power amplifier

28 September, 2015 | Supplied by: Wireless Components

The MAAP-011140-DIE is a four-stage, 6 W power amplifier in bare die form that is fabricated using a GaAs pHEMT device process featuring full passivation. The power amplifier operates from 27.5 to 30 GHz and provides 24 dB of linear gain, 6 W saturated output power and 23% power-added efficiency.


conga-UMX6 µQseven computer modules

25 September, 2015 | Supplied by: Congatec Australia Pty Ltd

congatec is extending its product portfolio by offering computer-on-modules in the 40 x 70 mm sub-credit-card µQseven format. The first flagship module of the next-generation mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors.


Connectors in medical robotics

24 September, 2015 by Arthur Visser | Supplied by: Bishop & Associates

Traditionally employed in heavy industrial applications, robots are moving into other industries. In the medical field, they are used for surgery, therapy, diagnostics and much more.


BluGlass receives foundry order

23 September, 2015

BluGlass, an Australian clean tech company in the semiconductor industry, has received an order for $300,000 of foundry development from one of its key specialised epitaxy (foundry) customers.


Terasic Technologies MAX 10 Nios II Embedded Evaluation Kit

23 September, 2015 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The MAX 10 Nios II Embedded Evaluation Kit (NEEK), from Terasic Technologies, supports test and development of the Altera MAX 10 non-volatile FPGAs, offering a comprehensive design environment with everything embedded developers need to create a processing-based system. The kit allows developers to customise their processor and IP to suit their specific needs.


Renesas R-Car T2 SoC for vehicle camera networks

21 September, 2015 | Supplied by: Braemac Pty Ltd

Renesas Electronics has announced the R-Car T2 system-on-chip, an SoC dedicated for ethernet AVB-enabled vehicle camera networks. The product enables the delivery of high-resolution camera video through multiple systems while maintaining real-time performance with low latency levels.


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