Components

BluGlass receives foundry order

23 September, 2015

BluGlass, an Australian clean tech company in the semiconductor industry, has received an order for $300,000 of foundry development from one of its key specialised epitaxy (foundry) customers.


Terasic Technologies MAX 10 Nios II Embedded Evaluation Kit

23 September, 2015 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The MAX 10 Nios II Embedded Evaluation Kit (NEEK), from Terasic Technologies, supports test and development of the Altera MAX 10 non-volatile FPGAs, offering a comprehensive design environment with everything embedded developers need to create a processing-based system. The kit allows developers to customise their processor and IP to suit their specific needs.


Renesas R-Car T2 SoC for vehicle camera networks

21 September, 2015 | Supplied by: Braemac Pty Ltd

Renesas Electronics has announced the R-Car T2 system-on-chip, an SoC dedicated for ethernet AVB-enabled vehicle camera networks. The product enables the delivery of high-resolution camera video through multiple systems while maintaining real-time performance with low latency levels.


HARTING IIC MICA modular platform of open hardware and software

21 September, 2015 | Supplied by: HARTING Pty Ltd

The HARTING IIC MICA is a modular platform of open hardware and software that can be swiftly adapted to many industrial application areas. The platform consists of a compact, robust computer, suitable for scenarios in industry and rail systems, that has been tested in accordance with EN 50155 and other industry and railway standards.


Carbon research may boost nanoelectronics

18 September, 2015

The smallest of electronics could one day have the ability to turn on and off on an atomic scale.


Squishy transistors

18 September, 2015

Researchers have shown that a new device concept — a 'squishy' transistor — can overcome the predicted power bottleneck caused by CMOS (complementary metal-oxide-semiconductor) technology reaching its fundamental limits.


X-ES XPand6903 fanless embedded box PC

17 September, 2015 | Supplied by: Metromatics Pty Ltd

Extreme Engineering Solutions (X-ES) has announced the XPand6903, a rugged, sealed, compact, fanless, embedded box PC utilising the Intel Atom E3800 family processor. The product provides a maintenance-free computing platform that is suitable for environmentally challenging and space-constrained situations.


Making the IoT configuration more secure

11 September, 2015

Researchers have identified easy-to-use techniques to configure IoT objects in order to make them more secure and, hence, help protect them from online attacks.


congatec conga-TC170 COM Express compact modules

04 September, 2015 | Supplied by: Congatec Australia Pty Ltd

The conga-TC170 COM Express compact modules, from congatec, are said to offer users improvements in graphics and processing performance, enhanced energy efficiency and high-speed I/Os.


Single-layer LEDs

03 September, 2015

Researchers have developed a new highly efficient and low-cost LED that could spur more widespread adoption of the technology.


Axiomtek eBOX626-842-FL fanless embedded system

03 September, 2015 | Supplied by: Braemac Pty Ltd

Axiomtek has launched the eBOX626-842-FL, an energy-efficient fanless embedded box system suitable for rugged and extreme applications.


MACOM MABC-001000-DP000L GaN bias controller/sequencer module

03 September, 2015 | Supplied by: Wireless Components

The MACOM MABC-001000-DP000L is a gallium nitride bias controller/sequencer module that provides proper gate voltage and pulsed drain voltage biasing for a device under test (DUT).


Greenvity Hybrid Mesh networking technology for IoT applications

02 September, 2015 | Supplied by: Greenvity Communications

Greenvity Communications has announced Hybrid Mesh, a mesh networking technology that provides a communications link for commercial building and industrial applications. The technology utilises mixed-medium IEEE 802.15.4 wireless and wideband powerline communication (PLC).


Spectrum pre-amplifiers

01 September, 2015 | Supplied by: TRIO Test & Measurement

For applications where low-level electronic signals need to be analysed, Spectrum pre-amplifiers can be used to boost signal levels. Seven different versions are available, offering gain ranges from 20 to 60 dB, bandwidths from 10 MHz to 2 GHz, and 50 Ω and 1 MΩ terminations.


Boron-doping of graphene nanoribbons

31 August, 2015

Researchers have succeeded in synthesising boron-doped graphene nanoribbons and characterising their structural, electronic and chemical properties.


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