Components

congatec conga-TC170 COM Express compact modules

04 September, 2015 | Supplied by: Congatec Australia Pty Ltd

The conga-TC170 COM Express compact modules, from congatec, are said to offer users improvements in graphics and processing performance, enhanced energy efficiency and high-speed I/Os.


Single-layer LEDs

03 September, 2015

Researchers have developed a new highly efficient and low-cost LED that could spur more widespread adoption of the technology.


Axiomtek eBOX626-842-FL fanless embedded system

03 September, 2015 | Supplied by: Braemac Pty Ltd

Axiomtek has launched the eBOX626-842-FL, an energy-efficient fanless embedded box system suitable for rugged and extreme applications.


MACOM MABC-001000-DP000L GaN bias controller/sequencer module

03 September, 2015 | Supplied by: Wireless Components

The MACOM MABC-001000-DP000L is a gallium nitride bias controller/sequencer module that provides proper gate voltage and pulsed drain voltage biasing for a device under test (DUT).


Greenvity Hybrid Mesh networking technology for IoT applications

02 September, 2015 | Supplied by: Greenvity Communications

Greenvity Communications has announced Hybrid Mesh, a mesh networking technology that provides a communications link for commercial building and industrial applications. The technology utilises mixed-medium IEEE 802.15.4 wireless and wideband powerline communication (PLC).


Spectrum pre-amplifiers

01 September, 2015 | Supplied by: TRIO Test & Measurement

For applications where low-level electronic signals need to be analysed, Spectrum pre-amplifiers can be used to boost signal levels. Seven different versions are available, offering gain ranges from 20 to 60 dB, bandwidths from 10 MHz to 2 GHz, and 50 Ω and 1 MΩ terminations.


Boron-doping of graphene nanoribbons

31 August, 2015

Researchers have succeeded in synthesising boron-doped graphene nanoribbons and characterising their structural, electronic and chemical properties.


element14 launches Raspberry Pi space sensor module

28 August, 2015 | Supplied by: element14

element14 has globally launched the Raspberry Pi Sense HAT that allows enthusiasts to control the same hardware used in space.


MEN Mikro Elektronik BL70W box PC

24 August, 2015 | Supplied by: OEM Technology Solutions

The robust box PC BL70W was developed for wireless applications in mobile markets. Its compliance with E-mark requirements makes it suitable for automotive applications in buses, construction vehicles or agriculture machines.


Electronic ribbon can monitor health, infrastructure

19 August, 2015

Researchers are developing flexible, bendable, even stretchable electronics for applications in harsh environments for aircraft, explosive devices and even combatants themselves.


Breakthrough optics pave way for new technologies

19 August, 2015

A new approach to designing optical technologies could give optics the kind of versatility we see in electronics.


Breakthrough in thin-film magnetism

17 August, 2015

Researchers have discovered an unusual magnetic effect in nanolayers of an oxide of lanthanum and manganese (LaMnO3). They have revealed an abrupt magnetic transition brought about by the slightest change in thickness of the layer.


Sierra Wireless AirPrime HL7549 LTE embedded module

17 August, 2015 | Supplied by: M2M Connectivity

The AirPrime HL7549 LTE embedded module, from Sierra Wireless, supports B3 (1800 MHz), B7 (2600 MHz) and B28 (700 MHz) on Australian cellular networks. The device supports LTE Cat 4 aimed at improving network capacity, throughput, data speed and operational cost efficiency.


MACOM MAAP-011145 power amplifier

14 August, 2015 | Supplied by: Wireless Components

The MACOM MAAP-011145 power amplifier is assembled in a 7 mm surface-mount, lead-free cavity package with a temperature-compensated integrated power detector operating from 17.65 to 19.75 GHz.


Toshiba 16-die stacked NAND flash memory with TSV technology

11 August, 2015 | Supplied by: Toshiba (Australia) Pty Ltd

Toshiba has announced the development of a 16-die (max) stacked NAND flash memory utilising Through Silicon Via (TSV) technology.


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