Components

Big investments boost flexible sensors market

29 September, 2015 by Guillaume Chansin, Senior Technology Analyst, IDTechEx Research

The US Department of Defense recently awarded $75 million to establish a new Manufacturing Innovation Institute (Mii) for flexible hybrid electronics in San Jose, California.


First optical rectenna converts light to direct current

29 September, 2015

The first optical rectenna, a device that combines the functions of an antenna and a rectifier diode, can convert light directly into direct current.


MACOM MAAP-011140-DIE power amplifier

28 September, 2015 | Supplied by: Wireless Components

The MAAP-011140-DIE is a four-stage, 6 W power amplifier in bare die form that is fabricated using a GaAs pHEMT device process featuring full passivation. The power amplifier operates from 27.5 to 30 GHz and provides 24 dB of linear gain, 6 W saturated output power and 23% power-added efficiency.


conga-UMX6 µQseven computer modules

25 September, 2015 | Supplied by: Congatec Australia Pty Ltd

congatec is extending its product portfolio by offering computer-on-modules in the 40 x 70 mm sub-credit-card µQseven format. The first flagship module of the next-generation mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors.


Connectors in medical robotics

24 September, 2015 by Arthur Visser | Supplied by: Bishop & Associates

Traditionally employed in heavy industrial applications, robots are moving into other industries. In the medical field, they are used for surgery, therapy, diagnostics and much more.


BluGlass receives foundry order

23 September, 2015

BluGlass, an Australian clean tech company in the semiconductor industry, has received an order for $300,000 of foundry development from one of its key specialised epitaxy (foundry) customers.


Terasic Technologies MAX 10 Nios II Embedded Evaluation Kit

23 September, 2015 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The MAX 10 Nios II Embedded Evaluation Kit (NEEK), from Terasic Technologies, supports test and development of the Altera MAX 10 non-volatile FPGAs, offering a comprehensive design environment with everything embedded developers need to create a processing-based system. The kit allows developers to customise their processor and IP to suit their specific needs.


Renesas R-Car T2 SoC for vehicle camera networks

21 September, 2015 | Supplied by: Braemac Pty Ltd

Renesas Electronics has announced the R-Car T2 system-on-chip, an SoC dedicated for ethernet AVB-enabled vehicle camera networks. The product enables the delivery of high-resolution camera video through multiple systems while maintaining real-time performance with low latency levels.


HARTING IIC MICA modular platform of open hardware and software

21 September, 2015 | Supplied by: HARTING Pty Ltd

The HARTING IIC MICA is a modular platform of open hardware and software that can be swiftly adapted to many industrial application areas. The platform consists of a compact, robust computer, suitable for scenarios in industry and rail systems, that has been tested in accordance with EN 50155 and other industry and railway standards.


Carbon research may boost nanoelectronics

18 September, 2015

The smallest of electronics could one day have the ability to turn on and off on an atomic scale.


Squishy transistors

18 September, 2015

Researchers have shown that a new device concept — a 'squishy' transistor — can overcome the predicted power bottleneck caused by CMOS (complementary metal-oxide-semiconductor) technology reaching its fundamental limits.


X-ES XPand6903 fanless embedded box PC

17 September, 2015 | Supplied by: Metromatics Pty Ltd

Extreme Engineering Solutions (X-ES) has announced the XPand6903, a rugged, sealed, compact, fanless, embedded box PC utilising the Intel Atom E3800 family processor. The product provides a maintenance-free computing platform that is suitable for environmentally challenging and space-constrained situations.


Making the IoT configuration more secure

11 September, 2015

Researchers have identified easy-to-use techniques to configure IoT objects in order to make them more secure and, hence, help protect them from online attacks.


congatec conga-TC170 COM Express compact modules

04 September, 2015 | Supplied by: Congatec Australia Pty Ltd

The conga-TC170 COM Express compact modules, from congatec, are said to offer users improvements in graphics and processing performance, enhanced energy efficiency and high-speed I/Os.


Single-layer LEDs

03 September, 2015

Researchers have developed a new highly efficient and low-cost LED that could spur more widespread adoption of the technology.


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