Flexible glass for flexible electronics
11 May, 2015German technology companies SCHOTT AG, tesa SE and VON ARDENNE GmbH have formed an industry consortium to develop new technologies for the use of glass on roll in organic electronics.
Researchers create optically active quantum dots in 2D semiconductors
07 May, 2015Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.
New device allows increased qubit densities
06 May, 2015 by American Institute of PhysicsA team of researchers at Georgia Tech Research Institute and Honeywell International have developed new chip architecture that may provide foundation for quantum computer.
Vishay Dale Thin Film PLTT 0603 thin-film chip resistor
06 May, 2015 | Supplied by: Fastron ElectronicsVishay Intertechnology's PLTT precision high-temperature thin-film chip resistor is now available in an AEC-Q200 automotive-qualified 0603 case size.
Qwerty soft keyboards for wearables
06 May, 2015Researchers from the Universitat Politècnica de València and the University of Stuttgart have developed two tiny Qwerty soft keyboard prototypes that enable users to answer or enter text on their wearable devices.
Alta Data Technologies PC104P-MA4 interface card for PC/104-Plus systems
05 May, 2015 | Supplied by: Metromatics Pty LtdAlta Data Technologies announces the release of the PC104P-MA4 interface card for PC/104-Plus systems. The product combines MIL-STD-1553 and ARINC interface channels on a single card, providing a small footprint and low power for PC/104-based systems.
MACOM MAAP-011022 S-band 7 W pulsed high-power amplifier
05 May, 2015 | Supplied by: Wireless ComponentsThe MACOM MAAP-011022 high-power balanced amplifier operates from 2.7 to 3 GHz, provides 7 W of pulsed power and is designed to operate at an 8% duty cycle.
Axiomtek tBOX322-882-FL fanless railway embedded system
02 May, 2015 | Supplied by: Braemac Pty LtdAxiomtek has launched tBOX322-882-FL, a fanless railway embedded PC based on the 4th generation Intel Core i7 or i3 processor with a wide temperature capability from -40 to +70°C. The embedded system is suitable for IoT and M2M-related applications such as onboard devices controller, train management, gateway, security surveillance and rolling stock environments.
Aaeon AEC-6402 ultracompact embedded controller
01 May, 2015 | Supplied by: Interworld Electronics and Computer IndustriesThe AEC-6402 ultracompact embedded controller, from Aaeon, is a fanless embedded computer measuring 20 mm thick with a good amount of processing power.
SEMIKRON silicon carbide power modules
30 April, 2015 | Supplied by: Semikron DanfossSEMIKRON offers full silicon carbide power modules in MiniSKiiP, SEMITOP and SEMITRANS housings, as well as hybrid silicon carbide modules in SEMITRANS and SkiM63/93 packages.
Renesas Electronics RX23T 32-bit microcontrollers
29 April, 2015 | Supplied by: Braemac Pty LtdRenesas Electronics has introduced the RX23T group of microcontrollers, designed to enable precise control of inverter circuits employed in energy-efficient equipment.
Qld start-up secures $3m funding for its polymer technology
24 April, 2015Queensland-based start-up TenasiTech has received $3 million in investor support for its scratch-resistant and environmentally sustainable acrylic glass.
Dewesoft Krypton ruggedised distributed EtherCAT data acquisition modules
24 April, 2015 | Supplied by: Metromatics Pty LtdDewesoft has released Krypton, its latest ruggedised distributed EtherCAT DAQ modules. The modules are engineered to weather all conditions and to operate in cold, hot, dusty, mud, snow and water environments.
Veeco to evaluate BluGlass's RPCVD p-GaN
22 April, 2015Veeco Instruments has proposed to evaluate BluGlass's RPCVD p-GaN for LED and power electronic applications, following BluGlass's recent announcement of its improved performance data.
ACES sets pace for additive manufacturing revolution
22 April, 2015The ARC Centre of Excellence for Electromaterials Science (ACES) at the University of Wollongong is helping to set the pace in the next revolution in additive manufacturing.
