Wearable camera market to soar
22 April, 2015Wearable camera shipments are set to increase to 30.6 million units a year by 2020 from 5.6 million in 2014, according to market research firm Tractica.
Vincotech 1200 V SiC MOSFET-based power modules
21 April, 2015 | Supplied by: Wireless ComponentsVincotech's latest 1200 V SiC MOSFET-based power modules, available in two versions, are designed specifically for solar, UPS and battery management applications.
Axiomtek PICO840 Pico-ITX single-board computer
20 April, 2015 | Supplied by: Braemac Pty LtdAxiomtek has launched PICO840, an ultrasmall Pico-ITX embedded SBC utilising the latest quad-core Intel Atom processor and supporting DDR3L-1066/1333 MHz system memory up to 8 GB. The product is suitable for system integrators looking for a versatile and ultracompact single-board computer.
Low-power control technology for wearables
17 April, 2015Toshiba has developed an innovative low-power control technology for microcontrollers supporting multisensor wearable devices.
Australian breakthrough paves the way to large quantum computers
13 April, 2015
A UNSW-led research team has encoded quantum information in silicon using simple electrical pulses for the first time, bringing the construction of affordable large-scale quantum computers one step closer to reality.
Inkjet-printed liquid metal could bring wearable tech
13 April, 2015New research shows how inkjet-printing technology can be used to mass-produce electronic circuits made of liquid-metal alloys for 'soft robots' and flexible electronics.
Liquid crystal for organic thin-film transistors
13 April, 2015Researchers at Tokyo Institute of Technology and the Japan Science and Technology Agency have designed a smectic liquid crystal that overcomes many of the challenges posed by organic field effect transistor materials.
Antennas on a chip
10 April, 2015 by Gehan AmaratungaUniversity of Cambridge researchers have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip.
Antennas on a chip
10 April, 2015 by Gehan AmaratungaUniversity of Cambridge researchers have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip.
Advantech MIO-2263 2.5″ Pico-ITX SBC
07 April, 2015 | Supplied by: Advantech Australia Pty LtdAdvantech has announced the MIO-2263 SBC in a 2.5″ Pico-ITX (100 x 72 mm) form factor. Based on the Intel Atom processor E3800 product family, the system-on-chip (SoC) is designed for intelligent systems with quad core computing and high graphics and media performance.
MACOM MAAP-011139-DIE power amplifier
04 April, 2015 | Supplied by: Wireless ComponentsDeveloped by MACOM, the MAAP-011139-DIE is a four-stage, 4 W power amplifier that operates from 29 to 31 GHz and provides 24 dB of linear gain (@ 30 GHz), 4 W saturated output power and 23% efficiency while biased at 6 V.
Vishay Semiconductors VBUS05B1-SD0 ESD protection diode
03 April, 2015 | Supplied by: Future ElectronicsThe Vishay Semiconductors VBUS05B1-SD0 is suitable for the protection of high-speed data lines and antennas against transient voltage signals.
Researchers increase MoS2's light emission by 12 times
02 April, 2015Monolayer molybdenum disulfide's (MoS2) ultrathin structure is strong, lightweight and flexible, making it a good candidate for many applications, such as high-performance, flexible electronics. However, such a thin semiconducting material has very little interaction with light, limiting the material's use in light emitting and absorbing applications.
Philips sells majority stake in LED components, automotive lighting business
02 April, 2015Royal Philips has signed a deal with a consortium led by GO Scale Capital to sell 80.1% interest in Philips' combined LED components and Automotive lighting business.
Low-cost, longer-life graphene light bulb
02 April, 2015University of Manchester researchers have developed a graphene light bulb with lower energy emissions, longer lifetime and lower manufacturing costs.
