IDEC RV8S solid-state interface relays
23 February, 2015IDEC Corporation has announced the RV8S solid-state interface relay, featuring 100 mA to 3A switching capability in a compact 6 mm wide space. Other features include high switching cycles, extended operating life and high-speed load switching.
Faster multicore chips
23 February, 2015 by Larry Hardesty, MIT News OfficeComputer chips' clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel.
IDEC RV8S solid-state interface relays
23 February, 2015 | Supplied by: IDEC Australia Pty LtdIDEC Corporation has announced the RV8S solid-state interface relay, featuring 100 mA to 3A switching capability in a compact 6 mm wide space. Other features include high switching cycles, extended operating life and high-speed load switching.
Better measurements of single molecule circuits
20 February, 2015It is nearly 50 years since Gordon Moore predicted that the density of transistors on an integrated circuit would double every two years. Moore's Law has turned out to be a self-fulfilling prophecy that technologists pushed to meet, but to continue into the future, engineers will have to make radical changes to the structure or composition of circuits.
Radiatation-resistant spintronic material
18 February, 2015Researchers at the University of Michigan and Western Michigan University are exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.
Extreme-temperature electronics
12 February, 2015 by Zhengzheng ZhangMany industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200°C.
Thermal management solution for microelectronic devices
10 February, 2015Microelectronic devices contain a multitude of transistors, and although each one produces very little heat individually, their combined thermal output is significant and can damage the device.
SkyWave IDP 200 Series satellite modems
04 February, 2015 | Supplied by: M2M ConnectivityM2M Connectivity introduces the IDP 200 Series satellite modems, developed by SkyWave Mobile Communications, in Australia and New Zealand. The satellite modems offer easy-to-integrate monitoring of vehicles and industrial equipment.
SkyWave IDP 200 Series satellite modems
04 February, 2015M2M Connectivity introduces the IDP 200 Series satellite modems, developed by SkyWave Mobile Communications, in Australia and New Zealand. The satellite modems offer easy-to-integrate monitoring of vehicles and industrial equipment.
Raspberry Pi 2 launches with ARMv7 quad core CPU
03 February, 2015element14 and Raspberry Pi Trading have launched Raspberry Pi 2 Model B, which is six times faster than the previous model and now boasts 1 GB of RAM to run bigger and more powerful projects.
Raspberry Pi 2 launches with ARMv7 quad core CPU
03 February, 2015 | Supplied by: element14element14 and Raspberry Pi Trading have launched Raspberry Pi 2 Model B, which is six times faster than the previous model and now boasts 1 GB of RAM to run bigger and more powerful projects.
Parallelising common algorithms
02 February, 2015 by Larry HardestyHardware manufacturers are making computer chips faster by giving them more cores, or processing units.
Advantech TPC-1251T/1551T thin-client panel computer
02 February, 2015 | Supplied by: Advantech Australia Pty LtdAdvantech's 12.1″ and 15″ TPC-1251T/1551T touch panel computers utilise the Intel Atom E3827 1.75 GHz processor. The computers feature iDoor technology, a flat screen and a multitude of I/O ports while being able to operate in a wide range of temperatures.
Toshiba NFC built-in SDHC memory card
02 February, 2015 | Supplied by: Toshiba (Australia) Pty LtdToshiba's Semiconductor & Storage Products Company has launched an SDHC memory card with built-in NFC (near field communication) functions in sizes of 8, 16 and 32 GB.
IoT strengthens components market growth
02 February, 2015 | Supplied by: RS
The rapidly evolving and growing smart home and Internet of Things (IoT) market will spark incredible growth in the electronic components market. Eric Lee, Head of Regional Technical Marketing Asia Pacific at RS Components, shares his views on opportunities and trends for 2015.
