Components

Toshiba DSOP Advance package MOSFETs

03 March, 2015 | Supplied by: Toshiba (Australia) Pty Ltd

Toshiba Corporation's Semiconductor & Storage Products Company has launched a surface-mount package series as part of its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation.


Toshiba DSOP Advance package MOSFETs

03 March, 2015

Toshiba Corporation's Semiconductor & Storage Products Company has launched a surface-mount package series as part of its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation.


Axiomtek CAPA881 3.5″ embedded single-board computer

02 March, 2015

Axiomtek has launched CAPA881, a 3.5″ embedded board supporting 4th generation Intel Core i7/i5/i3 processors (Haswell) which provide high computing performance and good power efficiency.


Axiomtek CAPA881 3.5″ embedded single-board computer

02 March, 2015 | Supplied by: Mouser Electronics (Hong Kong) Ltd

Axiomtek has launched CAPA881, a 3.5″ embedded board supporting 4th generation Intel Core i7/i5/i3 processors (Haswell) which provide high computing performance and good power efficiency.


Fibre-based electronic devices

27 February, 2015 by David L Chandler, MIT News Office

A new approach developed by MIT researchers could lead to a completely new way of making high-quality, fibre-based electronic devices.


Advantech ProView SCADA manageable switches

27 February, 2015 | Supplied by: Advantech Australia Pty Ltd

Advantech's ProView SCADA manageable switches are convergence switches for process control and IT networking management.


IDEC RV8S solid-state interface relays

23 February, 2015

IDEC Corporation has announced the RV8S solid-state interface relay, featuring 100 mA to 3A switching capability in a compact 6 mm wide space. Other features include high switching cycles, extended operating life and high-speed load switching.


Faster multicore chips

23 February, 2015 by Larry Hardesty, MIT News Office

Computer chips' clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel.


IDEC RV8S solid-state interface relays

23 February, 2015 | Supplied by: IDEC Australia Pty Ltd

IDEC Corporation has announced the RV8S solid-state interface relay, featuring 100 mA to 3A switching capability in a compact 6 mm wide space. Other features include high switching cycles, extended operating life and high-speed load switching.


Better measurements of single molecule circuits

20 February, 2015

It is nearly 50 years since Gordon Moore predicted that the density of transistors on an integrated circuit would double every two years. Moore's Law has turned out to be a self-fulfilling prophecy that technologists pushed to meet, but to continue into the future, engineers will have to make radical changes to the structure or composition of circuits.


Radiatation-resistant spintronic material

18 February, 2015

Researchers at the University of Michigan and Western Michigan University are exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.


Extreme-temperature electronics

12 February, 2015 by Zhengzheng Zhang

Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200°C.


Thermal management solution for microelectronic devices

10 February, 2015

Microelectronic devices contain a multitude of transistors, and although each one produces very little heat individually, their combined thermal output is significant and can damage the device.


SkyWave IDP 200 Series satellite modems

04 February, 2015

M2M Connectivity introduces the IDP 200 Series satellite modems, developed by SkyWave Mobile Communications, in Australia and New Zealand. The satellite modems offer easy-to-integrate monitoring of vehicles and industrial equipment.


SkyWave IDP 200 Series satellite modems

04 February, 2015 | Supplied by: M2M Connectivity

M2M Connectivity introduces the IDP 200 Series satellite modems, developed by SkyWave Mobile Communications, in Australia and New Zealand. The satellite modems offer easy-to-integrate monitoring of vehicles and industrial equipment.


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd