TI LDC1101 1.8 V inductance-to-digital converter
12 October, 2015 | Supplied by: Mouser Electronics (Hong Kong) LtdTexas Instruments (TI) has introduced the LDC1101 inductance-to-digital converter (LDC). The product is a 1.8 to 3.3 V, high-resolution data converter designed for short-range, high-speed, contactless sensing of position, rotation or motion.
Australian memory technology to revolutionise printable electronics
08 October, 2015 by Myles GoughAustralian researchers have developed a new material that can store digital information and be printed onto various surfaces. It could be used for memory cells in next-generation, large-scale printable electronics.
Turning trees into energy storage devices
08 October, 2015Scientists are turning trees into energy storage devices capable of powering everything from a smartwatch to a hybrid car.
Organic semiconductors get weird at the edges
07 October, 2015A new finding could lead to the next generation of cheaper, more efficient electronic devices.
Australian researchers overcome crucial quantum computing hurdle
07 October, 2015 by Wilson Da SilvaAustralian engineers have built a quantum logic gate in silicon for the first time, making calculations between two qubits of information possible — and thereby clearing the final hurdle to making silicon quantum computers a reality.
Vicor Corporation Picor PI354x Cool-Power ZVS buck regulators
02 October, 2015 | Supplied by: Vicor CorporationPI354x Cool-Power ZVS buck regulators utilise the integration of high-performance zero-voltage switching (ZVS) topology that enables 48 V direct to PoL without sacrificing performance, providing efficiency over 96%. With step-down regulation from a higher voltage source, engineers can deploy efficient power distribution architectures, reduce I2R losses and eliminate intermediate conversion stages.
New method could lead to cheaper electronic tattoos
30 September, 2015Researchers have developed a faster and inexpensive method to produce disposable tattoo-like health monitoring patches.
Vicor Corporation VIA BCM DC-DC front-end module
30 September, 2015 | Supplied by: Vicor CorporationVicor Corporation has introduced its VIA BCM K=1/8 DC-DC bus converter module. Operating from a 380 VDC nominal input and delivering an isolated SELV 48 V output, the product provides functional integration in a 9 mm-thin, thermally adept module incorporating EMI filtering, transient protection and inrush current limiting.
Self-assembling microflowers open new electronic frontiers
30 September, 2015RMIT University researchers have developed artificial microflowers that self-assemble in water and mimic the natural blooming process, an important step for advances in frontier-edge electronics.
Vishay Dale IHLD-3232HB-5A dual inductor
30 September, 2015 | Supplied by: Future ElectronicsVishay Intertechnology has expanded its IHLD series of low-profile, high-current dual inductors with a device in the 3232 case size. Offering a high operating temperature range to 155°C, the automotive-grade IHLD-3232HB-5A saves board space by combining two inductors in one 9.75 x 9.14 mm package.
Big investments boost flexible sensors market
29 September, 2015 by Guillaume Chansin, Senior Technology Analyst, IDTechEx ResearchThe US Department of Defense recently awarded $75 million to establish a new Manufacturing Innovation Institute (Mii) for flexible hybrid electronics in San Jose, California.
First optical rectenna converts light to direct current
29 September, 2015The first optical rectenna, a device that combines the functions of an antenna and a rectifier diode, can convert light directly into direct current.
MACOM MAAP-011140-DIE power amplifier
28 September, 2015 | Supplied by: Wireless ComponentsThe MAAP-011140-DIE is a four-stage, 6 W power amplifier in bare die form that is fabricated using a GaAs pHEMT device process featuring full passivation. The power amplifier operates from 27.5 to 30 GHz and provides 24 dB of linear gain, 6 W saturated output power and 23% power-added efficiency.
conga-UMX6 µQseven computer modules
25 September, 2015 | Supplied by: Congatec Australia Pty Ltdcongatec is extending its product portfolio by offering computer-on-modules in the 40 x 70 mm sub-credit-card µQseven format. The first flagship module of the next-generation mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors.
Connectors in medical robotics
24 September, 2015 by Arthur Visser | Supplied by: Bishop & AssociatesTraditionally employed in heavy industrial applications, robots are moving into other industries. In the medical field, they are used for surgery, therapy, diagnostics and much more.
