Acromag XMC-6260 and XMC-6280 mezzanine modules
30 January, 2014 | Supplied by: Metromatics Pty LtdAcromag's XMC-6260 and XMC-6280 mezzanine modules provide a 10-gigabit ethernet (10GbE) interface solution for data-intensive, real-time embedded computing systems. High performance is achieved using a TCP/IP offload engine (TOE) ASIC connected to a PCI Express Gen2 x8 interface.
MIT researchers develop new transparent display technology
30 January, 2014MIT researchers have developed a new transparent display system that can have significant advantages over existing systems, at least for certain kinds of applications: a wider viewing angle, simplicity of manufacture, and potentially low cost and scalability.
Micron MT25Q SPI NOR Flash memory samples
29 January, 2014 | Supplied by: Arrow Electronics Australia Pty LtdMicron Technology has announced the availability of 45 nm Serial NOR Flash memory samples in 512 Mb, 1 Gb and 2 Gb densities with a standard SPI interface. The MT25Q SPI NOR devices offer high performance, enhanced security and drop-in compatibility with legacy NOR devices, enabling high-density SPI NOR adoption in consumer, automotive, industrial and networking applications.
Osram Opto Semiconductors Oslon Square LED
28 January, 2014 | Supplied by: Osram Australia Pty LtdExcessive heat generation is one of the main reasons why light-emitting diodes fail. With the Oslon Square, Osram Opto Semiconductors presents an LED that withstands high ambient temperatures particularly well.
Banner Engineering DF-G1 fibre amplifier with IO-Link
24 January, 2014 | Supplied by: Micromax Pty LtdBanner Engineering has added IO-Link communication to its DF-G1 fibre amplifier. The amplifier can now achieve point-to-point communication, allowing for complete configuration and monitoring capabilities.
3D graphene from sugar bubbles
24 January, 2014Researchers have created a new way of making 3D graphene using bubbles blown in a polymeric glucose solution.
Silicine, the new graphene?
22 January, 2014Researchers at the University of Wollongong have successfully fabricated single-atom-layer silicine. The material could be used to develop faster computer chips, more practical and efficient solar cells, improved medical technologies and vehicle and aircraft parts.
Algorithm helps make faces more memorable
21 January, 2014 by Helen Knight, MIT News correspondentResearchers at MIT's Computer Science and Artificial Intelligence Laboratory (CSAIL) have developed an algorithm which makes subtle changes to various points on the face to make it more memorable without changing a person's overall appearance.
maxon motor Escon Module 50/4 EC-S brushless DC motor controller
20 January, 2014 | Supplied by: maxon motor Australia Pty LtdThe latest brushless DC motor controller from maxon motor has dimensions of 43 x 11 mm. The easy-to-use product features an OEM plug-in style form factor for easy integration into new equipment designs.
Wraparound electronics
17 January, 2014Researchers are developing electronics that can be wrapped around a single strand of hair. The development is expected to open up new possibilities for ultrathin, transparent sensors.
New technology to pave way for cheap, transparent electronics
10 January, 2014 by Tom Abate, Stanford EngineeringEngineers from the University of Nebraska-Lincoln (UNL) and Stanford University have created thin-film organic transistors that could operate more than five times faster than previous examples of this experimental technology.
Wavelex WAT06E 30 dB attenuator
09 January, 2014 | Supplied by: Wireless ComponentsThe WAT06E precision attenuator from Wavelex operates from DC to 6 GHz, with 50 Ω impedance and up to 30 dB attenuation, and features 20 W continuous wave (CW) RF power handling and 1.2:1 VSWR. It is suited for wideband power attenuation, high power measurement, high power IP measurement and RF bench test applications.
Texas Instruments SimpleLink Wi-Fi CC3000 processor
09 January, 2014 | Supplied by: RSRS Components is stocking the SimpleLink WiFi CC3000 product family from Texas Instruments (TI). The TI CC3000 module is a self-contained 802.11 wireless network processor that simplifies and accelerates the implementation of internet connectivity. The SimpleLink Wi-Fi solution minimises the software requirements of the host microcontroller (MCU) and is thus suitable for embedded applications using any low-cost and low-power MCU with a compact memory footprint.
Anaren Xinger III femto-sized 3 dB hybrid coupler
08 January, 2014 | Supplied by: Wireless ComponentsThe low-profile, high-performance X3C25F1-03S, the latest femto-sized coupler in the Xinger III range of products from Anaren, has been miniaturised to a 3 x 5 mm footprint without sacrificing electrical performance.
Intel outlines plans for wearables, security market
08 January, 2014 | Supplied by: Intel Australia Pty LtdIntel Corporation CEO Brian Krzanich has announced a range of initiatives to accelerate wearable device innovation. Krzanich made the announcements during the pre-show keynote for the 2014 International Consumer Electronics Show. He also demonstrated Intel-developed designs for wearable devices at the show.
