Dispersion Switches
12 February, 2001 | Supplied by: AMS Instrumentation & Calibration Pty Ltd
AMS Technical Services has introduced a new line of thermal dispersion flow and level switches, NuTec 2000.
Aviant dual BX Single Board Computer
12 February, 2001 | Supplied by: Interworld Electronics and Computer Industries
Interworld Electronics has announced the Aviant dual BX single board computer that features dual Pentium III processor support.
Audio Amplifier
12 February, 2001 | Supplied by: Adilam Technologies
TelCom Semiconductor has announced its first high-performance audio amplifier.
Processor Cores
12 February, 2001 | Supplied by: Braemac Pty Ltd
Altera has unveiled technical details of its RISC-based Excalibur embedded processor cores for system-on-a-programmable-chip (SOPC) designs.
256 kMRAM universal memory chip unveiled
07 February, 2001
Motorola Labs, partnering with the DigitalDNA Laboratories of the Semiconductor Products Sector, has disclosed an industry milestone in developing MRAM (magnetoresistive random access memory).
Gate Oxide Fabrication Method for MOS Devices
13 December, 2000
In an increasingly mobile world of go-anywhere, do-everything personal products, the semiconductor industry is locked into a search for technologies that support lower power consumption and enhanced reliability in highly integrated LSI.
AEEMA Identifies Photonics Opportunities
01 December, 2000
To develop a strong vertically integrated photonics industry in Australia, maximum cumulative 'value-add' needs to be retained here, according to Angus M Robinson, Executive Director, AEEMA.
Optical Control Chip
01 December, 2000 | Supplied by: Arrow Electronics Australia Pty Ltd
Dallas Semiconductor has announced the DS1846 NV tri-potentiometer, memory and micromonitor, an integrated chip that enhances laser control and design flexibility in optical transceiver modules.
Sound Power System
01 December, 2000 | Supplied by: National Instruments Aust Pty Ltd
Acoustic engineers now can take advantage of a computer-based system from National Instruments for measuring noise emissions.
7.7 Inch Low-Temperature Polysilicon LCD
17 November, 2000 | Supplied by: Toshiba (Australia) Pty Ltd
Toshiba Corporation has announced commercialisation of a 7.7 inch, low-temperature, polysilicon thin film transistor (TFT) liquid crystal display (LCD), designed for mid-size electronic books supporting Microsoft's ClearType technology. Jointly developed by Microsoft and Toshiba the display will enter mass production at the beginning of 2001.
Acquisition Modules
17 November, 2000 | Supplied by: TekMark Australia Pty Ltd
Two acquisition modules and two software enhancements have been announced for the TLA Logic Analyser Family. The acquisition modules provide increased memory depth for the TLA700. The software enhancements include a capability that doubles timing speed and standardises the Windows 2000 operating system on both the TLA700 and TLA600.
Opportunities for Australian Photonics Industry
10 November, 2000
There is an opportunity for Australia to build a strong, wealth-creating photonics industry, but only if start-up photonics companies focus on the requirements of their customers, shareholders and staff, according to Mr Kevin Kalkhoven, recently retired chief executive of JDS Uniphase.
Photonics Forum
18 October, 2000
The Australian Photonics Cooperative Research Centre (CRC), in association with the Australian Electrical & Electronic Manufacturers' Association (AEEMA), is holding two forums on Wednesday 8th and Thursday 9th November, at the National Convention Centre in Canberra.
enhanced core family of digital signal processors
17 October, 2000
Taking the next step in the evolution of its DSP56800 core, Motorola Inc. today announced the enhanced DSP56800E core family of digital signal processors (DSPs).
RF CMOS Chipset Under Development
09 October, 2000 | Supplied by: Hyundai Australia Pty Ltd
Hyundai Electronics and Electronics and Telecommunication Research Institute have announced plans for the joint development of a radio frequency chipset, using the complementary metal oxide semiconductor (CMOS) fabrication process and RF CMOS integrated circuit technology.
