Renesas RZ/N1S IO-Link master development kit
03 December, 2018Renesas Electronics has introduced the RZ/N1S IO-Link master development kit to accelerate IO-Link-based application development for industrial networked devices in a smart factory.
Renesas Synergy AE-CLOUD2 Kit
03 October, 2018The Renesas Synergy AE-CLOUD2 kit is a complete hardware and software reference design that allows embedded developers to quickly evaluate cellular connectivity options and build low-power wide-area (LPWA) cellular Internet of Things (IoT) applications.
Coilcraft Designers Kits for RF, power, filter and data applications
01 August, 2018Coilcraft's Designers Kits are available for both surface-mount devices and thru-hole devices.
Digi-Key offers unlimited access to Ultra Librarian models
29 May, 2018Ultra Librarian enables visitors to search a database of over 40 million components to make part selection and sourcing decisions.
STMicroelectronics Profi MEMS Tool development platform
22 May, 2018The Profi MEMS Tool development platform by STMicroelectronics lets engineers visualise the behavior of ST's MEMS sensors, helping accelerate time to market and maximise the performance of product designs.
AAEON UP Squared Grove IoT Development Kit
12 April, 2018The UP Squared Grove IoT Development Kit, from AAEON, has been designed as a modular and ready-to-use toolset optimised for simplicity. The kit combines an AAEON UP Squared board and the Seeed Studio Grove prototyping system with the Arduino Create integrated online platform.
Intuitive use makes all the difference
23 March, 2018Machines simplify our everyday life in many different ways. But for this to work smoothly, the human-machine interface must be kept as simple as possible.
Water-repellent circuits for washable electronics
31 January, 2018US researchers have developed graphene printing technology that can produce flexible, low-cost, conductive and water-repellent electronic circuits.
Design unveiled for a silicon quantum computer chip
20 December, 2017As research teams worldwide explore ways to design a computer chip that can integrate quantum interactions, UNSW engineers believe they have found the solution.
Cypress Semiconductor WICED CYW43907 evaluation kit
23 November, 2017The WICED CYW43907 evaluation kit, from Cypress Semiconductor, offers engineers a product that is said to reduce time to market when producing production-ready Internet of Things (IoT) designs.
STMicroelectronics Modular Telematics Platform (MTP)
27 October, 2017The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping smart driving applications, including vehicle connectivity to back-end servers, road infrastructure and other vehicles.
STMicroelectronics and Objenious connecting IoT nodes to LoRa networks
09 October, 2017STMicroelectronics is working together with Internet of Things (IoT) specialist Objenious, a founding member of the LoRa Alliance, to accelerate the connection of IoT nodes to LoRa networks.
Terasic DE10-Nano development kit
29 August, 2017The DE10-Nano development kit, from Terasic Technologies, is a robust hardware design platform built around an Intel system-on-chip (SoC) FPGA, which combines a processor, peripherals and an FPGA fabric into a single, user-customisable device.
Creating lab equipment with cheap electronics
26 July, 2017European researchers have used cheap electronic components to create 'FlyPi' — a low-cost imaging and microscope system for research, training and teaching.
Open source 3D printing materials now available
11 May, 2017Aleph Objects and IC3D Industries have announced the availability of what is claimed to be the world's first certified open-source hardware 3D printing filament.
