Can AI speed up critical communications chip design?
05 June, 2025 by Cockrell School of Engineering, The University of Texas at AustinA team led by researchers from the University of Texas at Austin plans to add AI into the design process for developing high frequency comms chips.
Securing Embedded Edge Devices
01 June, 2025 by Brandon Lewis, Mouser ElectronicsImplementing embedded edge security through confidentiality, integrity and availability.
Ultra-thin bismuth for greener electronics
22 May, 2025Researchers have discovered an electrical property in ultra-thin bismuth that remains stable across temperature variations, opening new possibilities for environmentally friendly electronics.
Transforming marker ink into an electrical circuit
01 May, 2025A red marker ink containing eosin dye can be converted into a graphene-based electric circuit on any surface using a laser, thereby enabling flexible sensor fabrication.
FAULHABER diameter-matched components
01 May, 2025FAULHABER has released a range of components, including precision motors, gearheads and encoders, that are designed for seamless integration and enhanced performance.
Ultra-thin cooling solution for mobile devices
15 April, 2025Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe — that improves heat control for electronic components in smartphones and tablets.
Scientists unveil flexible OLED panel with built-in speaker
10 April, 2025Researchers have developed a smartphone-sized OLED display that can change its shape and act as a speaker with a piezoelectric actuator.
Feeling the future: wearable tech simulates realistic touch
04 April, 2025 by Amanda Morris, Northwestern UniversityResearchers from Northwestern University have developed a device that applies dynamic forces in any direction to simulate a more realistic sense of touch.
Enhancing stability in bioelectronic materials for computing
03 April, 2025Scientists from Rice University have streamlined the production of a material widely used in computing applications and medical research.
A multimodal light manipulator
28 March, 2025 by Anne J. Manning, Harvard John A. Paulson School of Engineering and Applied SciencesA new interferometer could replace beam-splitting waveguides for fibre-optics.
Tiny component for record-breaking bandwidth
20 March, 2025 by Fabio Bergamin, ETH ZurichA modulator developed by researchers from ETH Zurich has broken the terahertz mark. The ultrafast component efficiently transmits large volumes of data into the fibre-optic network in a short space of time.
How AI is remodelling the IoT
17 March, 2025 by Kjetil Holstad, EVP Strategy & Product Management, Nordic SemiconductorIncorporating AI into the IoT will dramatically enhance its capability and flexibility. But first, significant engineering challenges will need to be overcome.
Three Yamaha YSM20R Mounters Installed at GPC Electronics Maximising Capability and Scalability
11 March, 2025Hawker Richardson recently installed three Yamaha YSM20R mounters in the production line at GPC Electronics, to quickly transfer product between organisations.
Breaking the surface: how damage reshapes ripples in graphene
07 March, 2025Scientists have discovered how defects in the surface of two-dimensional sheets alter ripple effects, even freezing the sheets altogether.
Yamaha Robotics 1-Stop Smart Solution surface-mounter hardware
04 March, 2025The 1-Stop Smart Solution from Yamaha Robotics enhances the performance of its high-speed pick and place machines.
