Design > Componentry

ADLINK ISB-W890 server board

18 March, 2026

ADLINK has introduced the ISB-W890 server board, scaling Edge AI from traditional workloads to real-time generative AI and advanced analytics.


AMD VPR-7P132 Mini-ITX embedded motherboard

18 March, 2026

The mini-ITX embedded motherboard enables industrial and automotive developers to leverage multiple compute engines in parallel to process image and sensor data in real time.


Flexible fibre actuator converts electricity into motion

11 March, 2026

Researchers have developed ultra-thin soft fibres that bend and move when powered by electricity, creating flexible actuators that could power next-gen wearable tech.


Aerotech AGV-CPO 2-Axis laser scan head

04 March, 2026

The AGV-CPO 2-Axis laser scan head is designed to suit a range of laser applications, including electronics and semiconductor components manufacturing.


Turning peanut waste into graphene for next-gen electronics

26 February, 2026 by Neil Martin, UNSW

UNSW Sydney engineers have developed a cheaper and greener way to make graphene from leftover peanut shells.


Teledyne SCION VIS-SWIR cameras

21 January, 2026

Teledyne has launched the SCION Family of short-wave infrared (SWIR) cameras for a range of applications including material analysis and defect detection.


STMicroelectronics STM32MP21 microprocessors

15 January, 2026

The STM32MP21 microprocessors from STMicroelectronics feature a powerful processing engine and robust security architecture.


Diamond sensor reveals hidden magnetic fluctuations

05 December, 2025 by Scott Lyon, Princeton University

Scientists have used entangled defects in diamonds to detect magnetic signals at record sensitivity, opening new doors in physics and technology.


Single-photon switch advances photonic computing

27 November, 2025 by Purdue University College of Engineering

Researchers have demonstrated a single-photon photonic transistor, enabling light-based switching at ultra-low power levels.


Toshiba DCL52xx00 Series standard digital isolators

12 November, 2025

Toshiba has released a series of standard digital isolators that are suitable for a range of multi-channel high-speed communication applications.


Alta Data Technologies MP2-1553 interface card

11 November, 2025

The MP2-1553 interface card from Alta Data Technologies is designed for next-generation embedded avionics systems.


Light-based chip boosts AI power efficiency

18 September, 2025 by Eric Hamilton, University of Florida

Researchers have developed an optoelectronic silicon chip to perform convolution operations for artificial intelligence.


Semikron Danfoss thermal interface material

04 September, 2025

Semikron Danfoss offers a range of power modules with pre-applied thermal interface material.


Shining a UV light on next-gen computer chips

01 August, 2025 by Eric Stann, University of Missouri

A recent study could help scientists and engineers build faster, cheaper and more eco-friendly electronics.


Tiny sensor could turn a smartphone into a spectrometer

31 July, 2025 by Matt Shipman, North Carolina State University

Researchers have created a tiny spectrometric device the size of just a few millimetres, which can potentially be installed in a smartphone.


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