Design

Alexa now available for STM32 microcontrollers

13 April, 2018 | Supplied by: STMicroelectronics Pty Ltd

The X-CUBE-AVS software package from STMicroelectronics enables Amazon's Alexa Voice Service (AVS) to run on STM32 microcontrollers.


AAEON UP Squared Grove IoT Development Kit

12 April, 2018 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The UP Squared Grove IoT Development Kit, from AAEON, has been designed as a modular and ready-to-use toolset optimised for simplicity. The kit combines an AAEON UP Squared board and the Seeed Studio Grove prototyping system with the Arduino Create integrated online platform.


MathWorks MATLAB with NVIDIA TensorRT integration

04 April, 2018 | Supplied by: MathWorks Australia

MathWorks has announced that MATLAB now offers NVIDIA TensorRT integration through GPU Coder. This helps engineers and scientists develop AI and deep learning models in MATLAB with the performance and efficiency needed to meet the growing demands of data centres, as well as embedded and automotive applications.


One step closer to terahertz computer chips

02 April, 2018

Scientists have created technology that will enable our computers, and all optic communication devices, to run 100 times faster through terahertz microchips.


STMicroelectronics and Sigfox to connect billions of devices

23 March, 2018 | Supplied by: STMicroelectronics Pty Ltd

STMicroelectronics and Sigfox have announced a collaboration agreement to support the demand for connected devices for a broad range of applications.


Historic software editor released for general use

22 March, 2018

One of the world's early computer software editors, which is still in use today, is being released for free use by developers around the world.


MathWorks Release 2018a MATLAB and Simulink products

22 March, 2018 | Supplied by: MathWorks Australia

MathWorks has announced Release 2018a (R2018a) of its MATLAB and Simulink product families, introducing a range of additional capabilities.


Metalenses for MEMS chips

20 March, 2018

Researchers have developed a new type of lens using standard computer-chip technology that could replace the bulky layers and complex geometries of traditional curved lenses.


Charge your phone in a cup holder

09 March, 2018

A cup holder that wirelessly charges electronic devices in a 3D space has been developed by the Electronics and Telecommunications Research Institute in South Korea.


Water-repellent circuits for washable electronics

31 January, 2018

US researchers have developed graphene printing technology that can produce flexible, low-cost, conductive and water-repellent electronic circuits.


The rise of the digital twin

16 January, 2018 | Supplied by: MathWorks Australia

There are great advantages in the use of simulation models. Even before the first physical design, a new machine can be completely digitally designed and its full functionality can be checked by virtual test runs.


Microsemi SmartFusion2 FPGA maker board

11 January, 2018 | Supplied by: Digi-Key Electronics

Microsemi has announced the SmartFusion2 system-on-chip (SoC) field programmable gate array (FPGA) maker board, enabling firmware and design engineers to leverage the power of Microsemi's SmartFusion2 architecture.


Design unveiled for a silicon quantum computer chip

20 December, 2017

As research teams worldwide explore ways to design a computer chip that can integrate quantum interactions, UNSW engineers believe they have found the solution.


Cypress Semiconductor WICED CYW43907 evaluation kit

23 November, 2017 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The WICED CYW43907 evaluation kit, from Cypress Semiconductor, offers engineers a product that is said to reduce time to market when producing production-ready Internet of Things (IoT) designs.


MathWorks releases free 5G library

22 November, 2017 | Supplied by: MathWorks Australia

Computing software provider MathWorks has introduced a free 5G library aimed at supporting wireless design exploration in advance of the release of the initial 3GPP 5G standard specification in March 2018.


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