Knocking down microelectronics barriers
08 March, 2013Working together, DARPA and key companies from the semiconductor and defence industries are establishing the Semiconductor Technology Advanced Research Network (STARnet). This effort will support large university communities to look beyond the current evolutionary directions and make the discoveries that will drive technology innovation beyond what can be imagined for electronics today.
NI Measurement Studio 2013 for test and measurement system design
07 March, 2013 | Supplied by: http://www.ni.com/mstudioMeasurement Studio 2013 is claimed to be the only .NET software suite that provides all the tools needed to build a professional, end-to-end test or measurement system in Microsoft Visual Studio.
Microchip BodyCom uses human body as a secure, low-power communication channel
05 March, 2013 | Supplied by: Microchip Technology AustraliaMicrochip Technology has announced its BodyCom technology, which provides designers with a framework for using the human body as a secure communication channel. Compared to existing wireless methods, BodyCom technology provides lower energy consumption, while further increasing security via bidirectional authentication.
Rittal product selector app
04 March, 2013 | Supplied by: Rittal Pty LtdRittal’s latest iPhone app, Rittal Industrial Solutions, is a tool to assist users to create a complete Rittal solution.
RS Components mbed application board
04 March, 2013 | Supplied by: RSRS Components has available an mbed application board that supports rapid prototyping.
Highly energy-efficient CMOS logic systems
01 March, 2013Non-volatile bistable memory circuits being developed by Satoshi Sugahara and his team at Tokyo Institute of Technology are paving the way for highly energy-efficient CMOS logic systems.
Transient and vanishing electronics for the battlefield
25 February, 2013A new program aims to develop electronics that simply disappear when they are no longer needed on a battlefield. This will limit the access of enemy forces to the technologies and equipment harvesting.
Nanoscopic microcavities offer control in light filtering
11 February, 2013Using the geometric and material properties of a unique nanostructure, Boston College researchers have uncovered a novel photonic effect where surface plasmons interact with light to form ‘plasmonic halos’ of selectable output colour.
A new material for environmentally friendlier electronics
11 February, 2013A new ferroelectric material has been created by an international team of researchers. With properties analogous to those of a magnet in electricity, this new material has a lower impact on the environment.
ams AS3953 NFiC interface chip
05 February, 2013The ams AS3953 interface chip offers a high data-rate interface between an NFC device such as a smartphone and any host microcontroller with a standard serial peripheral interface (SPI).
FTDI FT313H host controller IC
01 February, 2013 | Supplied by: Glyn LtdThe FT313H host controller IC supports USB 2.0 high-speed (480 Mbps), full-speed (12 Mbps) and low-speed (1.5 Mbps) implementations. Designed for easy integration, it adds high-speed connectivity capability into a system through its support of standard USB class drivers.
NXP Semiconductors NextPower Live power MOSFETs for hot-swap applications
24 January, 2013 | Supplied by: NXP Semiconductors (Australia & New Zealand)NXP Semiconductors’ NextPower Live family of linear mode Power MOSFETs is designed specifically for use in hot-swap environments. The family offers both good linear mode performance and a low RDS(on) value.
International Rectifier IR3230SPbF gate drive IC simplifies eBike design
16 January, 2013 | Supplied by: Future ElectronicsInternational Rectifier has introduced the IR3230SPbF three-phase gate drive IC for e-bike inverters, providing efficient electric mobility.
Emerson Network Power ATCA-7470 40G ATCA blade
14 January, 2013 | Supplied by: Vertiv Australia Pty LtdThe latest 40G AdvancedTCA (ATCA) packet processing blade from Emerson Network Power - the ATCA-7470 - is designed to utilise the full capabilities of the Intel platform for communications infrastructure, formerly codenamed Crystal Forest, with an optimised balance of processing, memory, I/O, data movement and interfaces.
New 2D material for next-generation, high-speed electronics
11 January, 2013Australian scientists have produced a new two-dimensional material that could revolutionise the electronics market, making ‘nano’ more than just a marketing term. Made of layers of molybdenum oxides crystals, the new material has unique properties that encourage the free flow of electrons at ultrahigh speeds and overcomes the limitations of graphene.
