The GF300 and GF400 thermal interface materials are two-part, liquid silicone-based fillers that provide thermal performance of 3 W/mK (GF300) and 4 W/mK (GF400).
DuPont Transportation & Advanced Polymers has available the DuPont Zytel HTNFR42G30NH — a non-halogenated, flame-retardant, high-performance, bio-based PPA for SMT (surface mount technology) connectors and a broad range of electrical components.
Electrolube's thermal management range includes two silicone-based product lines: the thermal gap pads GP300 and GP500.
IPETRONIK's M-TDC Thermomodule is equipped with a special contacting technology, allowing the plugless upgrade of thermocouple measuring points. The sensor cable is directly inserted into the module, contacting and interlocking automatically.
Thermoelectric cooling can be better facilitated with the help of holey silicon — a computer chip wafer with tiny, vertically etched orifices that work to shuttle heat to desired locations.
LED manufacturers are set to be affected by changes regarding the thermal management of LEDs, driven by two major factors surrounding the issue of silicone.
Electrolube has launched a non-silicone heat transfer compound known as HTCX_ZF. The high-performance thermal management paste is an entirely zinc oxide (ZnO)-free version of HTCX, with improved thermal conductivity, lower oil bleed and lower evaporation weight loss.
TPM350 and TPM550 phase change materials offer high thermal conductivity, low phase change temperatures and low thermal resistance at the interface.
IPETRONIK has released the M-THERMO2 HV — a CAN temperature-measuring module with four type K thermocouple inputs offering maximum protection on high-voltage potentials up to ±846 V.
The DuPont Temprion thermal management materials are completely non-silicone and include thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.
The Fluke TiS55 Infrared Camera is designed for the quick identification of potential electrical, automotive, mechanical, HVAC/R and product development issues.
Sand in your computer sounds like something you'd like to avoid, right? Well, a research team at Georgia Institute of Technology is deliberately introducing sand into computers to help cool them.
3D white graphene could help control heat in electronic devices, according to Rice University researchers.
With the industrial test requirements and the material changes needed to meet RoHS regulations, understanding the thermal expansion of material is integral to the manufacturing process. PerkinElmer has introduced the TMA 4000, a thermomechanical solution to measure thermal expansion in electronic materials and other products. Additionally, the product can detect potentially harmful materials to ensure all electronic products are safe.
Researchers at the UPNA/NUP-Public University of Navarre have produced a prototype of a self-cooling thermoelectric device that achieves ‘free’ cooling of over 30ºC in devices that give off heat.