90 nm Semiconductor Manufacturing Process
Intel Corporation has made several technology breakthroughs that the company has integrated into its 90-nanometre process. It has used this process to build silicon structures and memory chips. It will put this process into volume manufacturing next year using 300 mm wafers.
This process combines higher -performance, lower-power transistors, strained silicon, high-speed copper interconnects and a low-k dielectric material. All of these technologies are integrated into the manufacturing process.
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