Insulating materials for microelectronics
Tuesday, 15 October, 2002
Researchers from the Commerce Departments National Institute of Standards and Technology reported they have developed methods for characterising key structural features of porous films being eyed as insulators for the ultrathin metal wires that will connect millions of devices on future microprocessors and increase processor speed.
It will help semiconductor manufacturers and their materials suppliers.
Related News
Siemens launches AI agent to automate PCB design workflows
Siemens has introduced the Fuse EDA AI Agent to automate workflows across semiconductor, 3D...
Flexible fibre actuator converts electricity into motion
Researchers have developed ultra-thin soft fibres that bend and move when powered by electricity,...
Designing smarter circuits with intelligent tools
Researchers have developed an artificial intelligence technology to automate analog semiconductor...
