Insulating materials for microelectronics
Tuesday, 15 October, 2002
Researchers from the Commerce Departments National Institute of Standards and Technology reported they have developed methods for characterising key structural features of porous films being eyed as insulators for the ultrathin metal wires that will connect millions of devices on future microprocessors and increase processor speed.
It will help semiconductor manufacturers and their materials suppliers.
Related News
Nano framework unlocks printable 2D electronics
Researchers have developed a predictive framework for 2D-material exfoliation — enabling...
Light-based chip boosts AI power efficiency
Researchers have developed an optoelectronic silicon chip to perform convolution operations for...
Shining a UV light on next-gen computer chips
A recent study could help scientists and engineers build faster, cheaper and more eco-friendly...
