An ultra-small and fast, electrically pumped all-optical memory on a silicon chip with record low power consumption has been produced by imec and its associated laboratory INTEC at the Ghent University.

Agilent is holding a series of spectrum analyser workshops in major cities across Australia.

A technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor of 10.

Two years after breaking ground in July 2007, Osram Opto Semiconductors has built and process-tested what is claimed to be the world's most modern LED chip production plant, in Penang, Malaysia.

Digi-Key and Vitesse Semiconductor have signed a global distribution agreement.

Eaton Corporation has appointed Craig Gob as managing director for the company’s Electrical Business in Australia and New Zealand based in Sydney.

Digi-Key Corporation and Amphenol Sine Systems have signed an agreement for the worldwide distribution of Sine Systems interconnect products.

Premier Farnell is expanding in the Asia Pacific with a new sales office in Penang, Malaysia.

Nextreme Thermal Solutions says it has cooled a laser diode in a TO-8 package using an embedded thin-film thermoelectric OptoCooler HV14 module.

Mouser Electronics has extended its distribution agreement with EPCOS into Europe and Asia.

Celemetrix Australia has taken its calibration service on the road, providing 24-hour turnaround time competitive pricing traceable to national standards with a pick-up and delivery service available.

Numonyx and Intel have demonstrated a 64 Mb test chip that has the ability to stack or place multiple layers of PCM arrays within a single die, allowing memory devices to be built with greater capacity, lower power consumption and smaller.

Origin Electronics Asia has extended its distribution agreement with Lattice Semiconductor from Greater China, ASEAN and India into Korea.

National Instruments and Denso Robotics are collaborating to integrate NI measurement and vision technology with Denso robotic arms. This is expected to increase productivity and performance in automated test, research and flexible manufacturing applications.

Essensium NV, a fabless provider of low power systems-on-chip, has joined the Wavenis Open Standard Alliance as a participating member, enabling it to influence the voting committees as the first semiconductor member, while continuing its partnership with Coronis SAS to complete Coronis's first Wavenis-compliant SOC.