Eliminate Unplanned Downtime: A Smarter Approach to Machine Diagnostics with the HYDAC HMG 4000
03 July, 2025The HYDAC HMG 4000 portable data recorder provides a smarter, faster, and more precise approach to machine diagnostics and predictive maintenance.
Next-gen adhesive technology for micro-LED displays
03 July, 2025Researchers have developed a novel dry adhesive technology that allows microscale LED components to be easily attached and detached.
Engineering ultra-thin magnets for next-gen electronics
27 June, 2025 by University of OttawaResearchers have developed ultra-thin magnets that could facilitate the development of faster, more energy-efficient electronics and communication systems.
Evaporative cooling tech could cut data centre energy use
18 June, 2025 by Liezel Labios, UC San Diego Jacobs School of EngineeringResearchers have developed a new evaporative cooling technology that could improve the energy efficiency of data centres and high-powered electronics.
Mouser Electronics: Powering Innovation for Australian Engineers
31 March, 2025Mouser Electronics offers cutting-edge components and resources to fuel the next generation of engineering solutions and future product development.
FUJI Smart Factory Platform NXTR A model
21 March, 2025The NXTR A model pick and place machine is designed to enhance productivity, maintain high-quality standards and reduce the need for manual intervention.
FAULHABER BX4 IMC motion control system
15 November, 2024The FAULHABER BX4 IMC motion control system offers an RS232 interface for PC or embedded master integration and a CANopen version suitable for industrial automation networks.
Quectel QLM29H Series GNSS receiver
31 October, 2024The Quectel QLM29H Series GNSS receiver combines the LC29H GNSS module and an integrated GNSS patch antenna to simplify RF design.
Hawker Richardson provides seamless implementation of SMT line at Philips Dynalite
01 October, 2024Philips Dynalite recently invested in a full SMT line supplied by Hawker Richardson, to optimise efficiencies and productivity, as well as minimise waste and ensure every board is produced to the highest quality.
STMicroelectronics X-CUBE-TCPP software pack
01 September, 2024The STMicroelectronics X-CUBE-TCPP software pack is designed to to simplify product designs by leveraging the USB Power Delivery specification.
No assembly required
02 July, 2024Researchers have built a machine that combines elements of traditional 3D printing with laser technology to develop multi-material, multi-functional products.
The clean path to reliable electronic products: Start-to-end PCB cleaning solutions
05 June, 2024Hawker Richardson's personalised service includes helping customers find the right cleaning products for a range of manufacturing requirements.
SC Manufacturing Solutions M2-900 laser marking system
02 May, 2024The M2-900 laser marking system from SC Manufacturing Solutions features four types of lasers (CO2, UV, green and fibre) to enhance performance.
The potential of flexible thin-film electronics for chip design
02 May, 2024New research has demonstrated the feasibility of the 'foundry' model for flexible electronics.
AB Chimie SND cleaning and de-fluxing solvent
01 May, 2024The SND cleaning and de-fluxing solvent is designed to remove grease, oil, flux residue and acrylic conformal coatings from PCBs.
