Components > Modules

TDK FS1406 µPOL DC-DC power modules

11 September, 2020

The TDK FS1406 µPOL DC-DC power modules integrate a matching MOSFET, inductor and driver in a single semiconductor embedded in a substrate (SESUB) package.


Laird Connectivity BL653 Series modules

22 July, 2020

The Laird Connectivity BL653 Series modules deliver Bluetooth 5.1 connectivity, long range, multi-wireless capabilities and an extended temperature range up to 105°C.


ICP DAS I-9K and I-97K series I/O modules

15 June, 2020

ICP DAS's I-9K (analog I/O) and I-97K (digital I/O) series I/O modules are suitable for combining a variety of I/O functions within the WP-9000, XP-9000, LX-9000 and LP-9000 programmable automation controllers (PACs).


Qorvo QPF4800 Wi-Fi 6 front-end module

11 June, 2020

Qorvo's QPF4800 Wi-Fi 6 front-end module (FEM) is designed for Wi-Fi 6 (802.11ax) applications, combining the high performance levels required to transfer HD and 4K video with the efficiency necessary for Internet of Things (IoT) applications.


Advantech ROM-5620 SMARC 2.1 module

01 June, 2020

Advantech's ROM-5620 SMARC 2.1 module features an ultralow-power consumption design and extended operating temperature of -40 to 85°C, suitable for automation equipment and HMI devices.


congatec conga-TR4 COM Express Type 6 module

19 May, 2020

congatec has introduced its conga-TR4 COM Express Type 6 modules with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40 to +85°C. They are available with optional burn-in and cold-soak stress screening.


SCHURTER C20F filtered power entry module with ground choke

21 April, 2020

SCHURTER has extended its power entry module series C20F with versions including a ground line choke, designed for suppressing high-frequency interference on the ground conductor.


Würth Elektronik Proteus-III and Thyone-I Bluetooth Low Energy 5.1 modules

11 March, 2020

Würth Elektronik has released the Bluetooth Low Energy 5.1 module Proteus-III and the proprietary version Thyone-I. Measuring 8 x 12 x 2 mm and based on the Nordic Semiconductor nRF52840 chipset, the module features integrated antennas, encryption technology and six configurable I/O pins.


Würth Elektronik MagI³C FDSM power modules

05 March, 2020

Würth Elektronik's MagI³C FDSM power modules with fixed 3.3 or 5 V output voltages are now available with an input voltage of 36 V.


IBASE RM-N8M series SMARC 2.0 CPU modules

25 February, 2020

The RM-N8M SMARC series targets lower power and small form factor systems. Measuring 82 x 50 mm, it is said to feature flexibility in terms of platform design and customisation for end-user applications, while reducing development time and accelerating time to market.


Acromag AcroPack AP730 Mini PCIe I/O module

21 February, 2020

The AP730 multifunction I/O module performs analog input, analog output, discrete I/O and counter/timer functions. A variety of carrier cards can host up to four modules and are available in PCIe, VPX, XMC, CompactPCI-Serial and mini-ITX embedded computing platforms.


u-blox SARA R410M 83B dual-mode cellular module for IIoT

20 February, 2020

u‑blox has announced certification of its dual-mode SARA‑R410M‑83B module for Australia on Telstra's LTE‑M and NB-IoT cellular network.


RECOM RPX2.5 all-in-one integrated power module

01 December, 2019

The RPX-2.5 all-in-one integrated module (buck regulator, inductor and capacitor) features flip-chip technology which increases power density and improves thermal management.


Laird Connectivity BL654PA power amplified module

29 November, 2019

The FCC, IC, RCM, KC and Bluetooth SIG-certified module allows engineers to implement single-mode Bluetooth 5 and Thread (802.15.4) technology into simple Bluetooth Low Energy designs.


Würth Elektronik MagI³C-VDMM power module series

07 November, 2019

The MagI³C-VDMM (Variable Step Down Micro Module) power module family from Würth Elektronik has been supplemented by more powerful 1 and 1.2 A versions.


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