congatec conga-TR4 COM Express Type 6 module
23 February, 2018congatec's conga-TR4 high-performance modules with COM Express Type 6 pinout are based on the latest AMD Ryzen Embedded V1000 multicore processors.
Artila RIO-2017PG C programmable analog-in remote I/O module
21 February, 2018Artila Electronics has announced the RIO-2017PG, a high-performance, compact, remote I/O module interface with up to eight isolated A/I channels.
Renesas Electronics ISL8274M dual 30 A and ZL9024M single 33 A power modules
06 February, 2018The dual ISL8274M operates from a 5 or 12 V power rail, provides two 30 A outputs and has up to 95.5% peak efficiency in an 18 x 23 mm2 footprint. The ZL9024M operates from a 3.3 V rail and outputs 33 A of power in a 17 x 19 mm2 footprint.
u-blox SARA R412M LTE Cat M1 and NB-IoT multimode module
30 January, 2018u-blox has announced the SARA‑R412M, an LTE Cat M1, NB-IoT and quad band 2G (EGPRS) module with worldwide coverage. Measuring 16 x 26 mm, the module provides both LTE and quad band EGPRS support in a single design.
Acromag AcroPack Series AP226 and AP236 rugged 8-channel isolated analog output modules
24 January, 2018Acromag has announced the expansion of its AcroPack Series with the AP226 and AP236. The modules provide built-in isolated voltage output signals to drive up to eight devices.
Murata WSM-BL241 nRF52-based Bluetooth 5 module
12 January, 2018The Murata WSM-BL241 module leverages the powerful Nordic nRF52832 system-on-chip (SoC) to provide high-performance Bluetooth low energy connectivity between smartphones, tablets and other devices.
TAIYO YUDEN EYSHSNZWZ ultrasmall Bluetooth 5 module
22 December, 2017The EYSHSNZWZ is an ultracompact Bluetooth Low Energy module from TAIYO YUDEN, designed to help developers easily implement Bluetooth 5 technology into designs.
STMicroelectronics PWD13F60 full-bridge system in package
11 December, 2017STMicroelectronics' PWD13F60 system in package (SiP) contains a complete 600 V/8 A single-phase MOSFET full bridge in a 13 x 11 mm outline.
MEN Mikro Elektronik Rugged COM Express (RCE) module CB30C
05 December, 2017The Rugged COM Express (RCE) module CB30C has been developed according to railway standards EN 50128 (software) and EN 50129 (hardware) and has received SIL 2 certification from TÜV SÜD.
Acromag AcroPack Series AP471 PCIe bus interface boards
23 November, 2017Acromag has announced an addition to its PCIe-based AcroPack Series. The AP471 offers 48 general-purpose, bidirectional I/O points to monitor and control a large quantity of digital devices. Inputs and outputs are CMOS and TTL compatible.
Quectel BG96MA LTE Cat M1/Cat NB1/EGPRS module
22 November, 2017BG96MA is a global version of the BG96 LTE Cat M1/Cat NB1/EGPRS smart module, supporting multimode technologies with a maximum data rate of 375 Kbps downlink and uplink.
SEMIKRON SEMITOP E1 and E2 power modules
01 November, 2017The second-generation SEMITOP fulfils SEMIKRON's aim to offer a safe supply chain to users. The packages represent the SEMITOP platform's natural evolution at the same high performance levels, set to offer a good footprint, a flexible architecture and high-performing solutions.
STMicroelectronics ST53G system-in-package for contactless payment with wearables
31 October, 2017STMicroelectronics is delivering technology for easy and secure contactless transactions using wearables such as wristbands, watches and jewellery. The ST53G system-in-package solution combines the company's expertise in near-field communication (NFC) and secure-transaction chips.
u-blox SARA-R410M-02B LTE Cat M1/NB1 multimode module
03 October, 2017u‑blox has announced the SARA‑R410M‑02B, a configurable LTE Cat M1/NB1 multimode module with worldwide coverage.
STMicroelectronics SLLIMM-nano 3 and 5 A intelligent power modules (IPMs)
29 September, 2017STMicroelectronics' SLLIMM-nano intelligent power modules (IPMs) have introduced extra package options and integrated additional components to accelerate development and simplify assembly of motor drives from very low power up to 300 W.
