Quectel EC25 IoT/M2M-optimised LTE category 4 high-speed module
12 September, 2016Quectel EC25 is a series of LTE category 4 modules optimised specially for M2M and IoT applications. Adopting 3GPP Rel. 11 LTE technology, it delivers 150 Mbps downlink and 50 Mbps uplink data rates.
Quectel EC21 IoT/M2M-optimised LTE category 1 module
09 September, 2016Quectel EC21 is a series of LTE category 1 modules optimised specially for M2M and IoT applications. It features low-power LTE connectivity and delivers M2M-optimised speeds of 10 Mbps downlink and 5 Mbps uplink.
Cypress Semiconductor CY8CKIT-143A PSoC 4 BLE 256K module
08 September, 2016Cypress Semiconductor has released a fully certified Bluetooth Low Energy (BLE) module for creating a complete BLE system with Bluetooth 4.2 features such as data length extension, upgraded privacy and enhanced security — all of which are critical for IoT applications.
MEN Mikro Elektronik G403 3U CompactPCI Serial board
05 August, 2016The G403 3U CompactPCI Serial board, with 16 bidirectional digital I/O channels, has been designed specifically for modern railway applications.
Advantech SOM-5991 COM Express Basic Module
29 July, 2016Advantech's SOM-5991 COM Express Basic Module, designed around the Intel Xeon processor D-1500 family, is powered by a server-grade processor that boasts up to 16-core scalability.
Silvertel Ag9900 ultraminiature module for the powered device
15 July, 2016Silvertel's Ag9900 series PD module comes in a small package size and is designed to extract power from a Cat5 cable. It fully conforms to the 802.3af Power over Ethernet (PoE) standard and includes 1.5 kV isolation, a PoE signature and an integral DC-to-DC converter.
Acromag microBlox uB isolated signal conditioning modules
13 July, 2016A full line of microBlox isolated signal conditioning modules is now available from Acromag. Offering over 175 models, the microBlox uB modules can safely interface a wide variety of voltage, current, temperature, frequency and other field signals with a ±5 V or 0–5 VDC output to host measurement and control systems.
congatec announces full support of SMARC 2.0
06 July, 2016Following the recent release of the new SMARC 2.0 specification, congatec has announced its full support of the specification. SMARC 2.0 was released by the Standardization Group for Embedded Technologies e.V. (SGET).
congatec conga-TS170 server-on-modules
27 June, 2016congatec has introduced server-on-modules for real-time media processing based on the latest Intel Xeon E3-1578L and E3-1558 processors. The modules feature the integrated Intel Iris Pro Graphics accelerated by 128 MB fast eDRAM and double graphics base frequency for high transcoding and video processing performance.
Pickering Interfaces 40–520 family PXI matrix modules
26 May, 2016Pickering Interfaces has announced the expansion of its range of 1-pole high-density PXI matrix modules. The 40–520 family of PXI matrix modules has high-density matrices with 22 different configurations and up to 256 crosspoints to suit a large variety of user requirements.
X-ES XPedite6401 XMC/PrPMC mezzanine module
24 May, 2016Extreme Engineering Solutions (X-ES) announces its first NXP QorIQ ARM-based board, the XPedite6401 XMC/PrPMC mezzanine module. The product is a good choice for a wide variety of applications that demand low power consumption coupled with high-performance processing.
Acromag AcroPack series I/O modules
21 May, 2016Acromag's PCIe-based AcroPack general-purpose I/O mezzanine modules for embedded computing applications are an extended version of the mPCIe specification. Featuring a 100-pin connector to handle the I/O, they provide a modular approach to system assembly, enabling application-specific customisation.
GainSpan GS2000 Wi-Fi modules with concurrent mode
20 April, 2016GainSpan's latest firmware release enables a module to operate both as a Wi-Fi station and a Limited AP in a time-multiplexed manner, giving the user the perception of concurrent Wi-Fi station and Limited AP mode operation. The networking mode is made possible by the dual-core architecture of the GS2000 SoC along with large memory resources.
SCHURTER KMF protection class II power entry module
15 April, 2016The KMF class II power entry module provides double insulation between energised components and exposed parts. This reinforced insulation is tested with a voltage of 4000 VDC between the energised conductor and the neutral conductor relative to the mounting panel.
Silicon Labs WGM110 Wizard Gecko Wi-Fi module
08 April, 2016The WGM110 Wizard Gecko, from Silicon Labs, has been engineered as an all-inclusive, plug-and-play 802.11b/g/n-compliant Wi-Fi module. The product delivers high radio frequency (RF) performance, good module size, easy application development and fast time to market.
