Components > Modules

ADLINK Express-HL COM Express Module

25 August, 2014

ADLINK's Express-HL is a COM Express COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 or Celeron processor, with CPU, memory controller and graphics processor on the same chip. It is designed for users who need high-level processing and graphics performance in a long product-life solution.


ON Semiconductor STK55xU3xxx-E integrated power modules

19 July, 2014

ON Semiconductor has expanded its high-voltage IPM portfolio with the STK55xU3xxx-E family. With a power range of 10 to 50 A in SIP and DIP packaging, the IPMs integrate a complete three-phase inverter including the gate drive circuit.


M2M Connectivity industrial protocol modules for Libelium Waspmote sensor nodes

08 July, 2014

M2M Connectivity has introduced the latest industrial protocol modules and API libraries for Libelium Waspmote sensor nodes that allow sensor information from industrial devices to connect to the cloud.


Molex HSAutoLink Media Modules

03 June, 2014

Molex HSAutoLink Media Modules enable the integration of multiple I/O port connection types such as USB, HDMI, 1394, ethernet, SD memory cards, auxiliary jack inputs and more to meet end-system requirements in either active or passive designs.


International Rectifier IRAM SIP1A Gen2 intelligent power modules

31 May, 2014

International Rectifier has introduced its energy-efficient intelligent power modules (IPMs). The second-generation IRAM system-in-package IPM shrinks and simplifies the design of appliance motor drive applications including air conditioners, fans, compressors and washing machines.


InnoDisk peripheral modules

30 May, 2014

InnoDisk's line of peripheral modules is suitable for embedded applications. Users will be able to interface to LAN, serial ports (USB/RS232-422-485/PCIe), storage devices and video displays easily through the space-efficient embedded peripheral boards.


ICP DAS WF-2019 Wi-Fi I/O module

26 May, 2014

ICP DAS's WF-2019 Wi-Fi I/O module is a 10-channel universal analog input module with voltage and current input types. The product provides accurate thermocouple measurement and automatic cold-junction compensation for each channel.


Vincotech flowMNPC 4w power modules

22 May, 2014

Vincotech has announced a set of modules for UPS and solar applications. The flowMNPC 4w second-generation modules come in flowSCREW 4w housings and feature MNPC topology.


GE Intelligent Platforms RAR15-XMC-FIO XMC avionics module

09 April, 2014

GE Intelligent Platforms has announced the RAR15-XMC-FIO for the MIL-STD-1553 and ARINC 429 XMC front I/O module. A multiprotocol embeddable avionics module featuring front I/O, it is designed to save space, weight and power.


Acromag BusWorks XT1210 and XT1220 ethernet modules

08 April, 2014

Acromag's BusWorks XT series of ethernet I/O modules now includes the XT1210 and XT1220 models, providing an 8-channel interface for analog voltage or current input signals and EtherNet/IP, Modbus/TCP, Profinet or peer-to-peer communication.


Acromag XT1230 and XT1240 analog input ethernet modules

15 March, 2014

Acromag has released the XT1230 and XT1240 in the BusWorks XT series of ethernet I/O modules. The models provide a 16-channel interface for single-ended analog current or voltage input signals with EtherNet/IP, Modbus/TCP, Profinet or i2o peer-to-peer communication.


GainSpan GS2011M Wi-Fi module

28 February, 2014

The GS2011M module by GainSpan provides a quick and easy way for device and appliance manufacturers to add Wi-Fi connectivity to their products. It adds low-power, high-speed Wi-Fi and internet connectivity to any device with a microcontroller and serial host interface.


TDK SESUB-PAN-T2541 Bluetooth 4.0 LE module

26 February, 2014

TDK has available an ultracompact Bluetooth low-energy module designed for the Bluetooth 4.0 low-energy (LE) specification (Bluetooth Smart). With its miniature footprint of 4.6 x 5.6 mm and slim insertion height of 1 mm, the SESUB-PAN-T2541 Bluetooth 4.0 LE module is designed for Bluetooth Smart devices. Due to its compact size, the module is suitable for use in wearable devices.


Vincotech flowSiC 0 power modules

24 February, 2014

Vincotech has rolled out its latest SiC-based products for efficient, high-frequency operation in solar inverter, UPS and battery management applications. The flowSiC 0 modules come in two versions.


Anaren A2541 Bluetooth Module

07 February, 2014

The Anaren A2541 Bluetooth Module is a low-power Bluetooth system which comes with a PCB antenna, software stack and DC/DC converter in a surface-mount package about the size of a postage stamp.


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