Semikron MiniSKiiP dual module
10 August, 2013The MIniSKiiP IGBT power semiconductor module family now features dual module versions, increasing the range’s power capability to 90 kW from 40 kW. The portfolio covers 150 A-300 A/650 V, 150 A-300 A/1200 V and 100 A-200 A/1700 V.
Light absorption in 2D semiconductors
05 August, 2013Working with ultrathin membranes of the semiconductor indium arsenide, researchers have discovered a quantum unit of photon absorption that should be general to all 2D semiconductors. This discovery not only provides new insight into the optical properties of 2D semiconductors and quantum wells, it should also open doors to exotic new optoelectronic and photonic technologies.
Boron arsenide rivals diamond as the best thermal conductor
10 July, 2013An unlikely material, cubic boron arsenide, could deliver an extraordinarily high thermal conductivity on par with the industry standard set by costly diamond, according to researchers from Boston College and the Naval Research Laboratory.
Texas Instruments installs automated warehouse system
13 June, 2013Texas Instruments has installed the AutoStore inventory management system in its product distribution centre (PDC) in Singapore. This marks the first installation of by a semiconductor in Asia.
Researchers move closer to low-cost, implantable electronics
13 June, 2013Researchers from The Ohio State University have developed technology that will pave the way for low-cost electronic devices that work in direct contact with living tissue inside the body. The first planned use of the technology is a sensor that will detect the very early stages of organ transplant rejection.
The formula for turning cement into a semiconductor
31 May, 2013Scientists from the US, Japan, Finland and Germany have developed a formula for turning liquid cement into liquid metal. This makes cement a semiconductor and opens up its use in the consumer electronics marketplace for thin films, protective coatings and computer chips.
Solving a semiconductor riddle
27 May, 2013New observations of material disprove leading theory about LED brightness, opening new avenues for research.
Stitching defects into the world’s thinnest semiconductor
27 May, 2013Researchers uncover key insights into the optical and electronic properties of molybdenum disulfide (MoS2), which can be either conducting or insulating to form the basic ‘on-off switch’ for all digital electronics.
New solar cell coating could boost efficiency
19 April, 2013 by David Chandler, MITThroughout decades of research on solar cells, one formula has been considered an absolute limit to the efficiency of such devices in converting sunlight into electricity.
STARC consortium selects MathWorks for model-based design
12 April, 2013MathWorks has announced that the Semiconductor Technology Academic Research Center (STARC) in Japan has selected and certified Matlab, Simulink and Embedded Coder as the preferred tools for model-based design in its new STARCAD-AMS design flow.
Paint-on plastic electronics
27 March, 2013Semiconducting polymers are an unruly bunch, but University of Michigan engineers have developed a new method for getting them in line that could pave the way for cheaper, greener, ‘paint-on’ plastic electronics.
Infineon Technologies single-chip radar solutions for industrial and commercial sensing
21 January, 2013Infineon Technologies has introduced its first single-chip radar solutions for applications in industrial and commercial sensing.
$2.2 million contract for power semiconductor technology to modernise the electrical power grid
14 December, 2012HexaTech has received a $2.2 million award that will enable the development of a new power semiconductor technology for the modernisation of the electrical power grid.
Better GaN circuits for radar and military systems
05 November, 2012DARPA has awarded a contract to RFMD to investigate how to enhance the thermal efficiency of gallium nitride (GaN) circuits used in high-power radar and other military systems.
Hybrid electronics: low-resistance carbon-IC interconnect fabrication
05 November, 2012Using a new method for precisely controlling the deposition of carbon, researchers have demonstrated a technique for connecting multiwalled carbon nanotubes to the metallic pads of integrated circuits without the high interface resistance produced by traditional fabrication techniques.
