New CNT ink enables see-through GPS devices
11 July, 2013Linde Electronics, the global electronics business of The Linde Group, has launched a revolutionary new carbon nanotube ink to drive innovation in the development of next-generation displays, sensors and other electronic devices.
Boron arsenide rivals diamond as the best thermal conductor
10 July, 2013An unlikely material, cubic boron arsenide, could deliver an extraordinarily high thermal conductivity on par with the industry standard set by costly diamond, according to researchers from Boston College and the Naval Research Laboratory.
Graphene keeps electronics cool
04 July, 2013A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25% - which can significantly extend the working life of computers and other electronics.
Transistors from nanoscale insulators
03 July, 2013It is now possible - even routine - to place millions of transistors on a single silicon chip. But at the rate the technology is progressing, in 10 or 20 years, transistors won’t get any smaller.
Lantronix XPort 05R embedded ethernet device server
02 July, 2013 | Supplied by: Soanar LimitedThe Lantronix XPort embedded ethernet device server is a compact, integrated solution to web enable virtually any device with serial capability. By incorporating it into a product design, manufacturers can quickly and easily offer serial-to-ethernet networking capability as a standard feature.
Quake Q-Puck Iridium modem with integrated antenna
01 July, 2013 | Supplied by: M2M ConnectivityThe Q-Puck comprises an Iridium modem embedded with an Iridium antenna in a single IP-rated package with serial/power. The product is fully Iridium-qualified and enables easy connection to Iridium’s SBD satellite network from an existing application with the minimum of hardware development.
Shaping sound with audio beamforming
01 July, 2013 by Werner de Bruijn, Philips Research | Supplied by: MathWorks AustraliaPhilips Research engineers have developed audio beamforming technology that varies the TV sound levels for two people in the same room.
Thin-film diamonds for future electronics
01 July, 2013A team of researchers has developed a new method for creating thin films of boron-doped diamond at temperatures low enough to coat electronic devices.
element14’s ‘wearable technology’ challenge for engineers
30 June, 2013element14 is challenging engineers and developers to design and develop their own piece of wearable technology.
Transistors for next-gen green electronics
28 June, 2013Researchers at UC Santa Barbara, in collaboration with the University of Notre Dame, have recently demonstrated the highest reported drive current on a transistor made of a monolayer of tungsten diselenide (WSe2), a 2-dimensional atomic crystal categorised as a transition metal dichalcogenide (TMD).
Tallysman Wireless TW4600 Iridium dual-feed antenna
28 June, 2013 | Supplied by: Step Global Pty LtdThe TW4600 is claimed to be the smallest dual-feed, high-performance Iridium antenna available. The product’s wideband dual feed patch element has a good axial ratio across the entire Iridium bandwidth.
Maestro Wireless Solutions M100 3G modem
27 June, 2013 | Supplied by: M2M ConnectivityThe M100 3G modem, from Maestro Wireless Solutions, is easy to install. As the latest additions to the Maestro 100 series, the M100 3G and M100 3G XT (version with GPS) are claimed to define a new benchmark in M2M modems.
Electronic components made from single molecules
21 June, 2013Now, for the first time, a transistor made from just one molecular monolayer has been made to work where it really counts. On a computer chip.
Using graphene to create computer chips
21 June, 2013A new system, proposed by MIT researchers, uses two-dimensional structures to guide plasmonic waves at ultrashort wavelength, offering a new platform for memory and computer chips.
A step towards silicon-based quantum computer
19 June, 2013Australian researchers have proposed a new way to distinguish between quantum bits that are placed only a few nanometres apart in a silicon chip, taking them a step closer to the construction of a large-scale quantum computer.
