InGaAs - keeping Moore’s Law alive
21 December, 2012The smallest InGaAs transistor ever built is providing a pathway that will allow the number of transistors on microchiops to continue to double every two years.
congatec modules for 3rd generation Intel Core processors
21 December, 2012 | Supplied by: Congatec Australia Pty LtdOffering a choice of three module versions, congatec now provides maximum graphics and processing power for both Type 2 and Type 6 Pin-out.
Phoenix Contact Plugtrab PT-IQ controller
20 December, 2012 | Supplied by: Phoenix Contact Pty LtdThe Plugtrab PT-IQ product family provides proactive functional monitoring for signal interface surge protection devices.
App store for Raspberry Pi
19 December, 2012Raspberry Pi, that low-cost, credit-card-sized computer that is exciting the programming and development world, has opened a store that offers total beginners an easier way to find everything they need to get going, in one place and for free. The Pi Store will make it easier for developers of all ages to share their games, applications, tools and tutorials with the rest of the community.
Magic win at Elektra Award
19 December, 2012Plessey’s MAGIC (MAnufactured on GaN ICs) High Brightness LED (HBLED) products have won the Solid-State Lighting Application Category of the Elektra Awards 2012. The winners were revealed last week at the European Electronics Industry Awards ceremony in London.
Phoenix Contact VL BPC 1000 industrial PC embedded box PCs
19 December, 2012 | Supplied by: Phoenix Contact Pty LtdPhoenix Contact has launched the VL BPC 1000 industrial PC product line of embedded box PCs for harsh industrial environments.
Banner Engineering SureCross B2Q Gateway Module
19 December, 2012 | Supplied by: Micromax Pty LtdThe Banner Engineering SureCross B2Q Gateway Module has been developed to provide embeddable and cost-effective communication capabilities for the company’s Q45 wireless sensor network.
Acromag TT230 series isolated transmitters
19 December, 2012 | Supplied by: Metromatics Pty LtdThe Acromag TT230 series of isolated transmitters are PC/Windows-programmable via USB for conversion of temperature, voltage and current inputs to sink/source-compatible 4-20 mA control signals.
Vishay Intertechnology WSBM8518 Power Metal Strip battery shunt resistor
18 December, 2012 | Supplied by: Braemac Pty Ltd
$2.2 million contract for power semiconductor technology to modernise the electrical power grid
14 December, 2012HexaTech has received a $2.2 million award that will enable the development of a new power semiconductor technology for the modernisation of the electrical power grid.
Scientists develop indium-free OLED for screen displays
11 December, 2012Scientists at the US Department of Energy’s (DOE) Ames Laboratory have discovered new ways of using a well-known polymer in organic light emitting diodes (OLEDs) which could eliminate the need for an increasingly problematic and breakable metal-oxide used in screen displays in computers, televisions and mobile phones.
Bluegiga BT111 Bluetooth Smart Ready HCI Module
11 December, 2012 | Supplied by: Glyn LtdBluegiga Technologies has available the Bluetooth Smart Ready HCI module, BT111.
Lighting up Christmas with unbreakable bulbs
11 December, 2012Decking your home with Christmas lights soon won’t include the hassle of burnt-out bulbs or broken strands. Scientists at Wake Forest University have made a new kind of light from mouldable plastic, which can glow in any colour, won’t shatter and won’t leave you with the problem of searching for the one bad bulb on a strand of dozens.
Acromag ACEX4405 carrier board for COM Express modules
11 December, 2012 | Supplied by: Metromatics Pty LtdThe Acromag ACEX4405 is a rugged carrier board for COM Express modules offering a wide assortment of peripheral I/O connections and a mini PCIe slot for production or prototype systems.
TDK Corporation CJA series of TDK SRCT capacitors
10 December, 2012 | Supplied by: TDK AustraliaTDK Corporation has developed the CJA series of TDK SRCT capacitors in case size 0603 (EIA 0201). Compared to existing multilayer ceramic capacitors (MLCCs) of the same case size, the mounting footprint has been reduced by 50%. In this design with bottom terminals, a solder resist prevents wetting of the face and side areas of the MLCCs with solder.