Building a better capacitor with manganese dioxide nanorods
26 April, 2013A new process for growing forests of manganese dioxide nanorods may lead to the next generation of high-performance capacitors.
New solar cell coating could boost efficiency
19 April, 2013 by David Chandler, MITThroughout decades of research on solar cells, one formula has been considered an absolute limit to the efficiency of such devices in converting sunlight into electricity.
Osram Ostar Stage LEDs
19 April, 2013 | Supplied by: Osram Australia Pty LtdThe Osram Ostar Stage LEDs from Osram Opto Semiconductors offer luminance of 48 million candelas per square metre and tunable colour tones from cold white to warm white.
Silicon-based millimetre-wave amplifiers set world record for power
18 April, 2013Two teams of Defense Advanced Research Projects Agency (DARPA) performers have achieved world record power output levels using silicon-based technologies for millimetre-wave power amplifiers.
Eltek Flatpack2 Integrated 19″ 2U power system
17 April, 2013 | Supplied by: Eltek AustraliaRedundancy in DC power systems has always been a challenge in industrial-type applications. In recognition of this, Eltek has fabricated the Integrated 19″ 2U power system, which is built around the Flatpack2 rectifier and designed for applications such as switchgear, telecom, emergency lighting and alarm systems. It has a compact design and is easily installed.
A step towards optical transistors?
17 April, 2013As demand for computing and communication capacity surges, the global communication infrastructure struggles to keep pace, since the light signals transmitted through fibre-optic lines must still be processed electronically, creating a bottleneck in telecommunications networks.
Regaining proper hearing with electroacoustic transducer
17 April, 2013Researchers from the Fraunhofer Institute for Manufacturing Engineering and Automation IPA in Stuttgart have developed a new device that will improve patients’ hearing and can be implanted during outpatient surgery.
Korean researchers develop a low-power 60 GHz RF chip for mobile devices
15 April, 2013As the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens and the ability to play higher definition video files.
Diamonds being used to develop next-gen transistors
15 April, 2013 by Mike Smyth, specialist technical writerDiamonds are not only the hardest material known, they are a good conductor of heat and, when suitably doped, become an excellent conductor of electricity. Laurens H Willems van Beveren, a senior postdoctoral research fellow in solid state physics at Melbourne University, is researching these and other properties of diamonds to perhaps develop the next generation of transistors.
Redesigned material could lead to lighter, faster electronics
12 April, 2013Chemists at The Ohio State University have developed the technology for making a one-atom-thick sheet of germanium and found that it conducts electrons more than 10 times faster than silicon and five times faster than conventional germanium.
STARC consortium selects MathWorks for model-based design
12 April, 2013 | Supplied by: MathWorks AustraliaMathWorks has announced that the Semiconductor Technology Academic Research Center (STARC) in Japan has selected and certified Matlab, Simulink and Embedded Coder as the preferred tools for model-based design in its new STARCAD-AMS design flow.
Development kit for Cypress’s PSoC 4 architecture now available for pre-order
11 April, 2013Premier Farnell and Cypress Semiconductor Corp have announced that customers can now pre-order the PSoC 4 Pioneer Development Kit from element14.
Kontron 3U VPX graphics board VX3324
11 April, 2013 | Supplied by: Kontron Australia Pty LtdThe Kontron 3U VPX graphics board VX3324 has been designed for long life cycle applications and is equipped with the AMD Radeon E6460 graphics processing unit. It targets military and aerospace applications.
Improving chip-cooling technology
05 April, 2013Researchers from the Georgia Institute of Technology have won a Defense Advanced Research Projects Agency (DARPA) contract to develop 3D chip cooling technology able to handle heat loads as much as 10 times greater than systems commonly used today.
Axiomtek Intel Core i7/i5/i3 Mini ITX motherboard
03 April, 2013 | Supplied by: Adept Total Turnkey SolutionsAxiomtek’s MANO861 industrial-grade Mini ITX motherboard based on the Intel H61 Express chipset is designed for the 3rd Generation Intel Core i7/i5/i3 processors in LGA1155 socket.
