Electronic function built into optical fibre
01 May, 2006A joint team from the University of Southampton in Britain and Penn State University in the US has combined the technologies of optical fibre and silicon/germanium to make devices inside microstructured fibres.
Basics of MOSFETs Part 2
05 April, 2006 by Vrej Barkhordarian, International Rectifier, El Segundo, Ca. | Supplied by: International RectifierDiscrete power MOSFETs employ semiconductor processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current levels are significantly different from the design used in VLSI devices
ZRL low noise very high IP3 amplifiers
03 April, 2006 | Supplied by: http://www.clarke.com.au/Mini-Circuit's Blue Cell technology allows the use of its 90-degree splitters to enhance the performance of a family of medium power amplifiers.
Mass production of memory technology
27 March, 2006Samsung Electronics, a manufacturer of advanced memory technology, has claimed it is the first manufacturer in the industry to begin mass producing DDR2 DRAM - 512 Megabit (Mb) - on an 80 nanometer (nm) scale.
Creating flexible electronic devices
06 March, 2006Researchers have developed a new process to make flexible, conducting ‘nano skins’ for a variety of applications, from electronic paper to sensors for detecting chemical and biological agents. The materials, which are described in the March issue of the journal Nano Letters, combine the strength and conductivity of carbon nanotubes with the flexibility of traditional polymers.
Basics of MOSFETs Part 1
05 March, 2006 by Vrej Barkhordarian, International Rectifier, El Segundo, Ca. | Supplied by: International RectifierDiscrete power MOSFETs employ semiconductor processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current levels are significantly different from the design used in VLSI devices
Horizontal multi-LEDs
02 March, 2006 | Supplied by: http://www.erntec.net/Suitable for displaying switching status, Mentor has developed horizontal SMD components for 3 mm LEDs. Between one and six LEDs, which are available in various quality, colours and combinations of colours, are integrated in the housing.
Free RF and Microwave Design seminars
02 March, 2006 | Supplied by: http://www.agilent.com/In late 2005, Agilent Technologies acquired Eagleware-Elanix and has announced the availability of Eagleware's GENESYS 2005, a new release of its popular RF and microwave design software.
USB microcontroller secures HDD access
08 February, 2006Fingerprint recognition technology has been used by Cypress Semiconductor and AuthenTec to introduce a reference design for adding biometric security to external hard disk drives (HDDs).
Playing the cards with embedded devices
05 February, 2006 by Andreas Geh*, Key Account Mgr for Digital-Logic smart embedded computers | Supplied by: Backplane Systems Technology Pty LtdIntel originally designed the Pentium M processor for mobile systems, such as notebooks, to meet the special requirements in this area. Nevertheless, these same characteristics also predestine this processor for embedded applications
High brightness white LED and matching secondary lens
01 February, 2006 | Supplied by: http://www.tenrod.com.au/Tenrod Australia introduces the newly released high brightness white LED from DOMINANT Semiconductors.
LED distributor
27 January, 2006Cutter Electronics will distribute Cree XLamp power LEDs in Australia and New Zealand.
Buffer module
09 January, 2006 | Supplied by: http://www.pepperl-fuchs.com/FEAS GmbH has introduced a buffer module as an alternative to accu-operated uninterruptible power supplies.
Microlab/FXR fixed attenuators
09 January, 2006 | Supplied by: ASD Technology Pty LtdASD Technology has released a range of fixed attenuators for wireless applications from Microlab/FXR.
Power LED module
06 December, 2005 | Supplied by: http://www.mrutty.com.au/Designed for emerging solid-state lighting uses, where ultra-bright illumination and a versatile colour range is desired in a reflow solderable design optimised for proper thermal management, BivarOpto has introduced a 3 W LED module.
