Philips and IBM are to jointly develop customer systems for radio frequency identification (RFID) and smart card applications. They plan to address the growing need for advanced high-security smart cards and RFID technology in day-to-day business processes, operations and consumer lifestyles.
Proving it is possible to use biology to create electronics, scientists at the Technion-Israel Institute of Technology have harnessed the power of DNA to create a self-assembling nanoscale transistor, the building block of electronics.
Researchers at Sandia National Laboratories developing ultraviolet (UV) light-emitting diodes (LEDs) recently demonstrated two deep UV semiconductor optical devices that set records for wavelength/power output. One emits at a wavelength of 290 nm and produces 1.3 milliwatts of output power, and the other emits at a wavelength of 275 nm and produces 0.4 milliwatts of power.
Engineers at Princeton University and Hewlett-Packard have invented a combination of materials that could lead to inexpensive, compact electronic memory devices for archiving digital images or other data.
Physicists have discovered a mechanism that forces sharp edges on the surface of a silicon crystal to become rounded, and have described this rounding in detail for the first time
Engineers have designed a new diode that transmits more electricity - conducting 150,000 A per square centimetre. Unlike other diodes in its class, called tunnel diodes, the new diode is compatible with silicon, so manufacturers could build it into mainstream electronic devices such as mobile phone and computers.
Silicon, one of the base elements of our planet, is the foundation of the modern information society. Modern electronics would be unthinkable without the development of silicon transistors
The Storage Networking Industry Association (SNIA) has approved the formation of SNIA (Australia and New Zealand) Ltd as a regional affiliate. The organisation will develop educational and marketing programs to promote the use of storage networking solutions to IT professionals via the working together of vendors, developers and integrators.
Epson is developing a ferroelectric material for ferroelectric random-access memory (FeRAM), a next generation type of memory. The new material has been tentatively named PZTN.