Components

Transponder coils

10 November, 2009 | Supplied by: Electronic Components Pty Ltd

Epcos is now offering motor vehicle electronics developers a sample kit with transponder coils.


PoE splitter

10 November, 2009 | Supplied by: Braemac Pty Ltd

Phihong has developed a 21 W power-over-ethernet splitter that provides 24 V at 0.875 A for powering security cameras, wireless network access points, IP phones and IP print servers.


A10200 ATCA single board computer

10 November, 2009 | Supplied by: Metromatics Pty Ltd

GE Fanuc has announced the A10200 ATCA single board computer, with a dual Xeon 5500 series dual- or quad-core processor and up to 64 GB of DDR3 SDRAM.


ASB200-810 embedded computer

10 November, 2009 | Supplied by: Backplane Systems Technology Pty Ltd

Backplane has released the ASB200-810, an Intel EP80579-based fanless computer system that houses an IBASE ECX810 ECX embedded board and is suitable for fanless platforms requiring multiple LAN ports for use in networking such as office or factory automation.


LCD glass continues to be scarce

03 November, 2009

In its Quarterly LCD Glass Subsctrate Report, DisplaySearch says that TFT LCD glass tightness this year will continue as TFT LCD panel makers are increasing capacity use and demanding more glass substrate from suppliers.


Ultra-shallow junctions for sub-32 nm CMOS devices

02 November, 2009

IMEC has combined vapour-phase doping and sub-melt laser annealing to fabricate high-quality, defect-free, ultra-shallow junctions (USJs) with abrupt dopant profile.


Spintronics research attracts $754,000 grant

01 November, 2009 by University of Surrey

A team of researchers, from the University of Surrey in England and two other institutions, has been awarded a grant of around $754,000 to develop ultra-small-scale silicon structures for ‘spintronic’ semiconductors.


Sierra Wireless MC8700 quad-band 3G HSPA+ module

22 October, 2009 | Supplied by: http://www.m2mconnectivity.com.au

The Sierra Wireless MC8700 module for HSPA+ networks is said to take advantage of the fastest mobile broadband networks available worldwide, enabling the expansion of product development into applications requiring higher bandwidth.


AC load banks

20 October, 2009 | Supplied by: Westek Electronics Pty Ltd

Avtron AC single- and three-phase load banks with dissipation capacities to 6 MW are now available. The banks, in addition to resistive loads, are also available as lagging reactive loads to 1575 kVAr. In addition, the combined resistive-reactive loads and resistive loads can be paralleled with reactive loads.


Module firmware

20 October, 2009 | Supplied by: M2M Connectivity

M2M Connectivity, Sierra Wireless’s Australian and New Zealand distributor for embedded modules, has available firmware for the HSPA+ MC8700 module - MC8700 Telstra M2.0.9.3AP firmware.


Boost converter

20 October, 2009 | Supplied by: element14

Linear Technology has announced the LT8415, a low-noise micropower boost converter with integrated dual half-bridge switches.


OLED displays

20 October, 2009 | Supplied by: Glyn Ltd

Univision has released two low-cost passive matrix OLED monochrome displays.


Energy gateway

20 October, 2009 | Supplied by: T Data Pty Ltd

Digi International has introduced a smart energy product family, including what is claimed to be the industry’s first ZigBee smart energy-ready modules and certified energy service portal gateways built on these modules.


M to M modems

20 October, 2009 | Supplied by: M2M Connectivity

M2M Connectivity has released the Maestro Heritage series of modems and kits that combine a base unit offering GSM/GPRS/EDGE with pluggable boards catering for diverse machine to machine applications.


Touch panel PC

20 October, 2009 | Supplied by: Soanar Limited

IEI has released a 15 widescreen panel PC that includes a 300 K pixel camera with low light function, digital microphone, 3 W speakers, resistive touch screen, Bluetooth, Wi-Fi connectivity and optional HSUPA module.


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