Components

Gigabit switches

01 January, 2009 | Supplied by: Metromatics Pty Ltd

GE Fanuc has announced two gigabit ethernet switches.


Suppression capacitors

01 January, 2009 | Supplied by: Soanar Limited

Vishay has released three X2 electromagnetic interference suppression film capacitors with an increased maximum mains voltage of 310 VAC and a wide range of lead pitches and capacitance values.


EMC RF amplifiers

01 January, 2009 | Supplied by: Westek Electronics Pty Ltd

Teseq (formerly the instrumentation division of Schaffner) has released a range of RF broadband, power amplifiers covering frequencies to 6 GHz and with outputs to 1100 W.


Zetex LED drivers

01 January, 2009 | Supplied by: Future Electronics

Diodes has further extended its Zetex LED driver series with the introduction of three miniature LED drivers offering improved accuracy and thermal performance.


Thyristor module

01 January, 2009 | Supplied by: Electronic Components Pty Ltd

Epcos has extended its series of thyristor modules with the TSM-LC100, designed for capacitive loads up to 100 kVAr at 400 V.


Optical components

01 January, 2009 | Supplied by: Caelera Pty Ltd

Finisar has available four 1310 nm optical components designed to meet the specifications of high-speed video applications.


DC servomotor

01 January, 2009 | Supplied by: M Rutty & Co Pty Ltd

Mavilor’s axial air gap dish armature is suitable for high-response servo drives.


Power inductors

01 January, 2009 | Supplied by: RS

Murata has enhanced its radial lead and toroidal surface-mount inductors with the addition of four ranges of RoHS-compliant components.


Dunkermotoren DC servomotors

01 January, 2009 | Supplied by: M Rutty & Co Pty Ltd

With servomotors BG45, BG65 and BG75, Dunkermotoren has available powerful and intelligent compact drives for customised drives.


Altium processor support

01 January, 2009 | Supplied by: Altium Pty Ltd

Altium has extended its FPGA support to include the Altera Stratix III and LatticeXP2 families of programmable devices.


Micro linear motors drive partnership

23 December, 2008

Epcos and New Scale Technologies have signed a technology cooperation agreement to develop ultrasonic motors.


Taiwan LED sales hold steady

09 December, 2008

Taiwan’s sales of new energy-efficient lights held steady during the third quarter of this year after demand slowed and energy prices that are encouraging the use of lower-cost lighting returned to nearly the same level as they were a year ago.


Phone chip under joint development

08 December, 2008

NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.


Taking the strain of silicon

28 November, 2008

University of Wisconsin-Madison engineers and physicists have developed a method of measuring how strain affects thin films of silicon that could lay the foundation for faster flexible electronics.


Stretching wires produces power

28 November, 2008

Researchers have developed a type of small-scale electric power generator able to produce alternating current through the cyclical stretching and releasing of zinc oxide wires encapsulated in a flexible plastic substrate with two ends bonded.


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