Graphene discovery wins major award
08 September, 2008
Two physicists from The University of Manchester who discovered the world’s thinnest material have scooped a major award for their work.
RF and microwave laminate
07 September, 2008 | Supplied by: http://www.clarke.com.au
Taconic’s TLX range of laminates can be sheared, drilled, milled and plated using standard manufacturing methods for PTFE/woven fibreglass materials. The laminates are dimensionally stable and exhibit virtually no moisture absorption during fabrication.
Chip scales under scrutiny
02 September, 2008
Smaller and faster are two goals in today’s electronics market, and an article in an international trade publication shows how North Dakota State University researchers, Fargo, design and build such electronics packages.
White LEDs go brighter
02 September, 2008
Osram development engineers are claiming new records for the brightness and efficiency of white LEDs in the laboratory.
Silicon back in the race for quantum computers
02 September, 2008
The odds that the quantum computer will be built of silicon have increased now that researchers from the Centre for Quantum Computer Technology (CQCT) have announced recently invented technology.
Compact cooling results in faster and more sensitive electronics
28 August, 2008
Researcher Srinivas Vanapalli has investigated the possibilities for the extreme cooling of electronic components at a chip level.
Standalone embedded control PCs
10 August, 2008 | Supplied by: Interworld Electronics and Computer Industries
The Boxer Series of products are high-performance standalone embedded PCs featuring: fanless operation, compact size, robust construction, low power requirements, high vibration/shock protection, wide operating temperature range and certified embedded OS support.
HSPA module
10 August, 2008 | Supplied by: http://www.m2mconnectivity.com.au
M2M Connectivity has launched the Sierra Wireless MC8790 module for 3G/HSPA networks. It is designed for developers integrating mobile broadband capabilities into modems, terminals, routers and other products requiring high-speed data over 3G/HSPA networks.
Couplers enable silicon photonics
07 August, 2008
Silicon photonics can now be more efficiently connected to mainstay low index contrast fibre following a development by Chiral Photonics scientists.
Switch sealing boots
01 August, 2008 | Supplied by: Switches Plus Components Pty Ltd
APM Hexseal has announced its IQ (Installs Quickly) range of sealing boots for retrofitting to existing control panels.
Motor drive package
01 August, 2008 | Supplied by: M Rutty & Co Pty Ltd
Electronically commutated DC motors now incorporate functions that were previously the preserve of AC servomotors.
EEPROM modules
01 August, 2008 | Supplied by: Microchip Technology Australia
Microchip has announced a series of serial presence detect EEPROM devices that support the latest double data rate 2 (DDR2) DIMM modules used in PCs, as well as future DDR3 DIMM modules.
NEC LCD module
01 August, 2008 | Supplied by: Soanar Limited
NEC LCD Technologies has introduced a 22.5" TFT LCD module with wide ultra-extended graphics array (WUXGA) resolution.
Integrated desktop
01 August, 2008 | Supplied by: Citrix Systems Pte Ltd
Citrix Systems has available XenDesktop and has revealed details about the complete product range, including the release of an Express Edition offering free desktop virtualisation for up to 10 users and new enterprise and platinum editions.
Voice interface chips
01 August, 2008 | Supplied by: Avnet Electronics Marketing
Zarlink Semiconductor has launched its latest family of voice interface solutions, the VE890 series, optimised for the international digital subscriber line market.
