Components

Graphene discovery wins major award

08 September, 2008

Two physicists from The University of Manchester who discovered the world’s thinnest material have scooped a major award for their work.


RF and microwave laminate

07 September, 2008 | Supplied by: http://www.clarke.com.au

Taconic’s TLX range of laminates can be sheared, drilled, milled and plated using standard manufacturing methods for PTFE/woven fibreglass materials. The laminates are dimensionally stable and exhibit virtually no moisture absorption during fabrication.


White LEDs go brighter

02 September, 2008

Osram development engineers are claiming new records for the brightness and efficiency of white LEDs in the laboratory.


Chip scales under scrutiny

02 September, 2008

Smaller and faster are two goals in today’s electronics market, and an article in an international trade publication shows how North Dakota State University researchers, Fargo, design and build such electronics packages.


Silicon back in the race for quantum computers

02 September, 2008

The odds that the quantum computer will be built of silicon have increased now that researchers from the Centre for Quantum Computer Technology (CQCT) have announced recently invented technology.


Compact cooling results in faster and more sensitive electronics

28 August, 2008

Researcher Srinivas Vanapalli has investigated the possibilities for the extreme cooling of electronic components at a chip level.


Standalone embedded control PCs

10 August, 2008 | Supplied by: Interworld Electronics and Computer Industries

The Boxer Series of products are high-performance standalone embedded PCs featuring: fanless operation, compact size, robust construction, low power requirements, high vibration/shock protection, wide operating temperature range and certified embedded OS support.


HSPA module

10 August, 2008 | Supplied by: http://www.m2mconnectivity.com.au

M2M Connectivity has launched the Sierra Wireless MC8790 module for 3G/HSPA networks. It is designed for developers integrating mobile broadband capabilities into modems, terminals, routers and other products requiring high-speed data over 3G/HSPA networks.


Couplers enable silicon photonics

07 August, 2008

Silicon photonics can now be more efficiently connected to mainstay low index contrast fibre following a development by Chiral Photonics scientists.


Vandal-proof keypad

01 August, 2008 | Supplied by: element14

Lorlin Electronics has introduced the KP range of vandal-proof metal keypads.


Switch sealer

01 August, 2008 | Supplied by: Switches Plus Components Pty Ltd

APM Hexseal has released its IQ (installs quickly) range of sealing boots.


Multi-chip LED

01 August, 2008 | Supplied by: Cutter Electronics

Cree has released its latest addition to the XLamp LED family, the MC-E LED.


Brushless DC-motors

01 August, 2008 | Supplied by: M Rutty & Co Pty Ltd

Dunkermotoren has released a brushless DC-motor BG 42 with Hall sensors and flying leads as well as the brushless DC-servomotor BG 45 with integrated power and logic electronics.


Multimedia processor

01 August, 2008 | Supplied by: Avnet Electronics Marketing

Freescale Semiconductor has introduced the i.MX37 multimedia applications processor, a device for a portable media player, mobile internet and portable GPS navigation.


Sealed computer

01 August, 2008 | Supplied by: Metromatics Pty Ltd

Computer Dynamics has announced SealTouch-15 rugged flat panel computers in an environmentally sealed enclosure that can be installed on an arm.


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