Components

Toshiba MG600Q2YMS3 and MG400V2YMS3 silicon carbide MOSFET modules

01 February, 2022 | Supplied by: Toshiba (Australia) Pty Ltd

Toshiba Electronic Devices & Storage has launched two silicon carbide (SiC) MOSFET dual modules: the MG600Q2YMS3, with a voltage rating of 1200 V and drain current rating of 600 A; and the MG400V2YMS3, with a voltage rating of 1700 V and drain current rating of 400 A.


congatec COM products with 12th Gen Intel Core processors

01 February, 2022 | Supplied by: Congatec Australia Pty Ltd

congatec introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 COM-HPC and COM Express computer-on-modules.


Axiomtek DSP511 multiple-view digital signage player

28 January, 2022 | Supplied by: Tekdis

Axiomtek introduces the DSP511, a 4K Ultra HD digital signage player with four HDMI 2.0 ports and a 2.5G Ethernet port to enhance multiple-view and real-time displays.


Switchback battlebot helps build passion for STEM

25 January, 2022 | Supplied by: STMicroelectronics Pty Ltd

STMicroelectronics has contributed multiple STM32 MCUs to the Switchback battlebot — a 113 kg robot that uses a dual-motor drum spinner mounted on an ambidextrous arm.


Quantum computing in silicon surpasses 99% accuracy

25 January, 2022

Three new studies have reported high-fidelity two-qubit gates based on spin qubits in silicon, confirming that robust quantum computing in silicon is now a reality.


Toshiba TLP223GA and TLP223J photorelays

25 January, 2022 | Supplied by: Toshiba (Australia) Pty Ltd

Toshiba Electronic Devices & Storage has launched two photorelays, the TLP223GA and TLP223J, with OFF-state output terminal voltage ratings of 400 and 600 V, respectively.


Würth Elektronik optocouplers

21 January, 2022 | Supplied by: Wurth Electronics Australia Pty

Würth Elektronik has expanded its optoelectronic portfolio with optocouplers in all common packages and CTR (current transfer ratio) values.


Researchers develop a fully 3D-printed, flexible OLED display

21 January, 2022

Researchers combined two different modes of printing to print the six device layers that resulted in a fully 3D-printed, flexible OLED display.


Samsung demonstrates MRAM-based in-memory computing

20 January, 2022

It has so far been difficult to use MRAM for in-memory computing, despite MRAM's merits such as operation speed, endurance and large-scale production.


Embedding an antenna into a cellular IoT design

20 January, 2022 | Supplied by: Nordic Semiconductor

By following some simple design guidelines, a single compact antenna can serve multiple radios in a cellular IoT product.


Antenova Atta embedded antenna

20 January, 2022 | Supplied by: Antenova Limited

Antenova has released its latest antenna, the Atta, for LTE and smart wireless deployments in the 410 and 450 MHz bands.


u-blox LARA-R6 and LENA-R8 LTE Cat 1 modules

20 January, 2022 | Supplied by: u-blox Singapore Pte Ltd

The u-blox LARA-R6 is claimed to be the smallest LTE Cat 1 module with global coverage on the market, while the u-blox LENA-R8 includes a GNSS receiver based on the u-blox M10 platform.


Laird Connectivity 5G Phantom on-ground plane antennas

17 January, 2022 | Supplied by: Mouser Electronics

Laird Connectivity's 5G Phantom on-ground plane antennas deliver up to 6 dBi of optimal circular gain and average efficiency of over 80%.


Mitsubishi Electric GS2110-WTBD-N and GS2107-WTBD-N graphic operation terminals

14 January, 2022 | Supplied by: Mitsubishi Electric Australia

The 10″ GS2110-WTBD-N and 7″ GS2107-WTBD-N widescreen models, which support virtual network computing (VNC), can be used as VNC servers enabling remote access from offices or other remote locations where field engineers may find themselves.


ADLINK COM-HPC-cADP and Express-ADP computer-on-modules

13 January, 2022 | Supplied by: ADLINK Technology Inc

ADLINK Technology introduces its 12th Gen Intel Core processor-based computer-on-modules (COMs), available in two form factors: COM-HPC Client Type and COM Express Type 6.


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