iEi Integration TANK AIoT Developer Kit for automation, building management and intelligent energy management
01 September, 2019The iEi Integration TANK AIoT Developer Kit is suitable for operational and information technologists, with an Intel core for optimal performance, pre-installed OpenVINO toolkit, Intel Media SDK and Ubuntu operating system for out-of-the-box ease of use, enabling rapid development and deployment.
STMicroelectronics and Arrow Electronics SPC5-L9177A-K02 ECU Reference Design
25 July, 2019To help the automotive industry meet the upcoming emissions regulations for single- and twin-cylinder petrol engines, STMicroelectronics and Arrow Electronics have released a complete reference design ECU (electronic control unit) for electronic fuel injection (EFI).
Particle Argon, Boron and Xenon development kits
16 May, 2019Particle offers a range of next-generation cloud-connected development kits with mesh-enabled networking, making it possible to extend the user’s sensor mesh network and get their devices connected to cloud, over Wi-Fi or cellular networks, in minutes.
Component design: what comes after Moore's law?
01 March, 2019Moore's law, which has predicted the rate of technological advancement for the past 50 years, is coming to an end. What does this mean for component design?
STMicroelectronics STSAFE-A100 Evaluation Pack
27 February, 2019STMicroelectronics' STSAFE-A100 Evaluation Pack extends the richly supportive STM32 Nucleo ecosystem to accelerate secure-element integration, leveraging re-usable source code that simplifies the creation of secure IoT devices and high-value consumables such as medical probes, IT accessories and consumer products.
STMicroelectronics STEVAL-FKI001V1 dual-radio Bluetooth/LPWAN IoT development kit
21 January, 2019The STMicroelectronics STEVAL-FKI001V1 dual-radio development kit gives users the flexibility to envision, build and connect IoT devices like smart sensors, finders and trackers which can be configured, updated, remotely monitored and tracked using various network topologies, protocols and services.
Renesas RZ/N1S IO-Link master development kit
03 December, 2018Renesas Electronics has introduced the RZ/N1S IO-Link master development kit to accelerate IO-Link-based application development for industrial networked devices in a smart factory.
Renesas Synergy AE-CLOUD2 Kit
03 October, 2018The Renesas Synergy AE-CLOUD2 kit is a complete hardware and software reference design that allows embedded developers to quickly evaluate cellular connectivity options and build low-power wide-area (LPWA) cellular Internet of Things (IoT) applications.
Coilcraft Designers Kits for RF, power, filter and data applications
01 August, 2018Coilcraft's Designers Kits are available for both surface-mount devices and thru-hole devices.
Digi-Key offers unlimited access to Ultra Librarian models
29 May, 2018Ultra Librarian enables visitors to search a database of over 40 million components to make part selection and sourcing decisions.
STMicroelectronics Profi MEMS Tool development platform
22 May, 2018The Profi MEMS Tool development platform by STMicroelectronics lets engineers visualise the behavior of ST's MEMS sensors, helping accelerate time to market and maximise the performance of product designs.
AAEON UP Squared Grove IoT Development Kit
12 April, 2018The UP Squared Grove IoT Development Kit, from AAEON, has been designed as a modular and ready-to-use toolset optimised for simplicity. The kit combines an AAEON UP Squared board and the Seeed Studio Grove prototyping system with the Arduino Create integrated online platform.
Intuitive use makes all the difference
23 March, 2018Machines simplify our everyday life in many different ways. But for this to work smoothly, the human-machine interface must be kept as simple as possible.
Water-repellent circuits for washable electronics
31 January, 2018US researchers have developed graphene printing technology that can produce flexible, low-cost, conductive and water-repellent electronic circuits.
Design unveiled for a silicon quantum computer chip
20 December, 2017As research teams worldwide explore ways to design a computer chip that can integrate quantum interactions, UNSW engineers believe they have found the solution.
