Design > Componentry

5G satellite tech advances global mobile connectivity

03 July, 2025

A global team has showcased new 5G satellite technology linking Singapore and Japan, enabling mobile connectivity in remote areas.


Memristor-based hardware to advance AI

03 July, 2025 by University of Massachusetts Amherst

A researcher from UMass Amherst is developing memristor-based hardware technology with the potential to advance AI while reducing energy usage and costs.


The Digilent Analog Discovery Studio Max's 14 Essential Instruments

11 June, 2025

A detailed overview of the 14 foundational instruments, including specialised analysis tools and powerful hardware, included with the Digilent Analog Discovery Studio Max (ADS Max).


Tackling global e-waste crisis with healable electronics

05 June, 2025 by Alex Parrish, Virginia Tech University

A new type of circuit board material could help keep e-waste out of landfills, according to a new study by researchers from Virginia Tech.


Can AI speed up critical communications chip design?

05 June, 2025 by Cockrell School of Engineering, The University of Texas at Austin

A team led by researchers from the University of Texas at Austin plans to add AI into the design process for developing high frequency comms chips.


Securing Embedded Edge Devices

01 June, 2025 by Brandon Lewis, Mouser Electronics

Implementing embedded edge security through confidentiality, integrity and availability.


Ultra-thin bismuth for greener electronics

22 May, 2025

Researchers have discovered an electrical property in ultra-thin bismuth that remains stable across temperature variations, opening new possibilities for environmentally friendly electronics.


FAULHABER diameter-matched components

01 May, 2025

FAULHABER has released a range of components, including precision motors, gearheads and encoders, that are designed for seamless integration and enhanced performance.


Transforming marker ink into an electrical circuit

01 May, 2025

A red marker ink containing eosin dye can be converted into a graphene-based electric circuit on any surface using a laser, thereby enabling flexible sensor fabrication.


Ultra-thin cooling solution for mobile devices

15 April, 2025

Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe — that improves heat control for electronic components in smartphones and tablets.


Scientists unveil flexible OLED panel with built-in speaker

10 April, 2025

Researchers have developed a smartphone-sized OLED display that can change its shape and act as a speaker with a piezoelectric actuator.


Feeling the future: wearable tech simulates realistic touch

04 April, 2025 by Amanda Morris, Northwestern University

Researchers from Northwestern University have developed a device that applies dynamic forces in any direction to simulate a more realistic sense of touch.


Enhancing stability in bioelectronic materials for computing

03 April, 2025

Scientists from Rice University have streamlined the production of a material widely used in computing applications and medical research.


A multimodal light manipulator

28 March, 2025 by Anne J. Manning, Harvard John A. Paulson School of Engineering and Applied Sciences

A new interferometer could replace beam-splitting waveguides for fibre-optics.


Tiny component for record-breaking bandwidth

20 March, 2025 by Fabio Bergamin, ETH Zurich

A modulator developed by researchers from ETH Zurich has broken the terahertz mark. The ultrafast component efficiently transmits large volumes of data into the fibre-optic network in a short space of time.


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