5G satellite tech advances global mobile connectivity
03 July, 2025A global team has showcased new 5G satellite technology linking Singapore and Japan, enabling mobile connectivity in remote areas.
Memristor-based hardware to advance AI
03 July, 2025 by University of Massachusetts AmherstA researcher from UMass Amherst is developing memristor-based hardware technology with the potential to advance AI while reducing energy usage and costs.
The Digilent Analog Discovery Studio Max's 14 Essential Instruments
11 June, 2025A detailed overview of the 14 foundational instruments, including specialised analysis tools and powerful hardware, included with the Digilent Analog Discovery Studio Max (ADS Max).
Tackling global e-waste crisis with healable electronics
05 June, 2025 by Alex Parrish, Virginia Tech UniversityA new type of circuit board material could help keep e-waste out of landfills, according to a new study by researchers from Virginia Tech.
Can AI speed up critical communications chip design?
05 June, 2025 by Cockrell School of Engineering, The University of Texas at AustinA team led by researchers from the University of Texas at Austin plans to add AI into the design process for developing high frequency comms chips.
Securing Embedded Edge Devices
01 June, 2025 by Brandon Lewis, Mouser ElectronicsImplementing embedded edge security through confidentiality, integrity and availability.
Ultra-thin bismuth for greener electronics
22 May, 2025Researchers have discovered an electrical property in ultra-thin bismuth that remains stable across temperature variations, opening new possibilities for environmentally friendly electronics.
FAULHABER diameter-matched components
01 May, 2025FAULHABER has released a range of components, including precision motors, gearheads and encoders, that are designed for seamless integration and enhanced performance.
Transforming marker ink into an electrical circuit
01 May, 2025A red marker ink containing eosin dye can be converted into a graphene-based electric circuit on any surface using a laser, thereby enabling flexible sensor fabrication.
Ultra-thin cooling solution for mobile devices
15 April, 2025Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe — that improves heat control for electronic components in smartphones and tablets.
Scientists unveil flexible OLED panel with built-in speaker
10 April, 2025Researchers have developed a smartphone-sized OLED display that can change its shape and act as a speaker with a piezoelectric actuator.
Feeling the future: wearable tech simulates realistic touch
04 April, 2025 by Amanda Morris, Northwestern UniversityResearchers from Northwestern University have developed a device that applies dynamic forces in any direction to simulate a more realistic sense of touch.
Enhancing stability in bioelectronic materials for computing
03 April, 2025Scientists from Rice University have streamlined the production of a material widely used in computing applications and medical research.
A multimodal light manipulator
28 March, 2025 by Anne J. Manning, Harvard John A. Paulson School of Engineering and Applied SciencesA new interferometer could replace beam-splitting waveguides for fibre-optics.
Tiny component for record-breaking bandwidth
20 March, 2025 by Fabio Bergamin, ETH ZurichA modulator developed by researchers from ETH Zurich has broken the terahertz mark. The ultrafast component efficiently transmits large volumes of data into the fibre-optic network in a short space of time.
